The Influence of Processing Conditions on the 3-D Interconnected Structure of Nanosilver Paste

Joshua A. Stuckner, Guo Quan Lu, Masatoshi Mitsuhara, William T. Reynolds, Mitsuhiro Murayama

Research output: Contribution to journalArticlepeer-review

7 Citations (Scopus)


Nanosilver paste is a promising material for power device interconnects. Interconnects are fabricated from nanosilver paste through a sintering process that drives off solvents and dispersants and fuses the silver particles. The integrity of the resulting interconnect is affected by the silver microstructure. This paper explored how sintering temperature, atmosphere, and time influenced microstructure as revealed by transmission electron microscopy and 3-D imaging via dual-beam serial sectioning. Nanosilver paste was sintered in combinations of the following parameters: A sintering atmosphere of air or nitrogen; temperatures of 120 °C or 255 °C; and sintering times of 5, 10, or 30 min. For the 255 °C temperature, oxygen in air facilitated removal of organic solvent and dispersant molecules and led to a microstructure with a coarser ligament network than samples sintered at the same temperature and times in nitrogen. The coarser ligament network was characterized by thick connected ligaments, large connected pores, and few isolated pores; this microstructure has been correlatedwith improved mechanical strength. Details of both 2-D and 3-D ligament network morphology, grain morphology, grain size, and the associated grain boundaries are discussed.

Original languageEnglish
Article number7809049
Pages (from-to)494-499
Number of pages6
JournalIEEE Transactions on Electron Devices
Issue number2
Publication statusPublished - Feb 2017

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering


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