Abstract
During wave soldering, it is important that a solder is able to flow easily to fill joints and to drain away to leave tidy fillets. The maximum fluidity length (L f) is a simple measure of the flow behavior of solidifying alloys, defined as the distance a cooling and solidifying alloy can flow in a constant cross-section before the developing microstructure arrests flow. This paper explores the influence of alloy composition on L f in Sn-rich Sn-Cu-Ag-Ni alloys with compositions relevant to wave soldering. Significant differences in L f are measured among candidate lead-free solder alloys, which are discussed with respect to the phase diagrams and the mode of solidification.
Original language | English |
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Pages (from-to) | 51-60 |
Number of pages | 10 |
Journal | Journal of Electronic Materials |
Volume | 37 |
Issue number | 1 |
DOIs | |
Publication status | Published - Jan 1 2008 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry