The maximum fluidity length of solidifying Sn-Cu-Ag-Ni solder alloys

C. M. Gourlay, J. Read, K. Nogita, A. K. Dahle

Research output: Contribution to journalArticlepeer-review

35 Citations (Scopus)

Abstract

During wave soldering, it is important that a solder is able to flow easily to fill joints and to drain away to leave tidy fillets. The maximum fluidity length (L f) is a simple measure of the flow behavior of solidifying alloys, defined as the distance a cooling and solidifying alloy can flow in a constant cross-section before the developing microstructure arrests flow. This paper explores the influence of alloy composition on L f in Sn-rich Sn-Cu-Ag-Ni alloys with compositions relevant to wave soldering. Significant differences in L f are measured among candidate lead-free solder alloys, which are discussed with respect to the phase diagrams and the mode of solidification.

Original languageEnglish
Pages (from-to)51-60
Number of pages10
JournalJournal of Electronic Materials
Volume37
Issue number1
DOIs
Publication statusPublished - Jan 1 2008

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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