The maximum fluidity length of solidifying Sn-Cu-Ag-Ni solder alloys

C. M. Gourlay; J. Read; K. Nogita; A. K. Dahle

doi:10.1007/s11664-007-0248-8

The maximum fluidity length of solidifying Sn-Cu-Ag-Ni solder alloys

C. M. Gourlay, J. Read, K. Nogita, A. K. Dahle

Faculty of Engineering

Research output: Contribution to journal › Article › peer-review

35 Citations (Scopus)

Abstract

During wave soldering, it is important that a solder is able to flow easily to fill joints and to drain away to leave tidy fillets. The maximum fluidity length (L _f) is a simple measure of the flow behavior of solidifying alloys, defined as the distance a cooling and solidifying alloy can flow in a constant cross-section before the developing microstructure arrests flow. This paper explores the influence of alloy composition on L _f in Sn-rich Sn-Cu-Ag-Ni alloys with compositions relevant to wave soldering. Significant differences in L _f are measured among candidate lead-free solder alloys, which are discussed with respect to the phase diagrams and the mode of solidification.

Original language	English
Pages (from-to)	51-60
Number of pages	10
Journal	Journal of Electronic Materials
Volume	37
Issue number	1
DOIs	https://doi.org/10.1007/s11664-007-0248-8
Publication status	Published - Jan 1 2008

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

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@article{8ad8f553c4524d2db999170a896b4c6e,

title = "The maximum fluidity length of solidifying Sn-Cu-Ag-Ni solder alloys",

abstract = "During wave soldering, it is important that a solder is able to flow easily to fill joints and to drain away to leave tidy fillets. The maximum fluidity length (L f) is a simple measure of the flow behavior of solidifying alloys, defined as the distance a cooling and solidifying alloy can flow in a constant cross-section before the developing microstructure arrests flow. This paper explores the influence of alloy composition on L f in Sn-rich Sn-Cu-Ag-Ni alloys with compositions relevant to wave soldering. Significant differences in L f are measured among candidate lead-free solder alloys, which are discussed with respect to the phase diagrams and the mode of solidification.",

author = "Gourlay, {C. M.} and J. Read and K. Nogita and Dahle, {A. K.}",

year = "2008",

month = jan,

day = "1",

doi = "10.1007/s11664-007-0248-8",

language = "English",

volume = "37",

pages = "51--60",

journal = "Journal of Electronic Materials",

issn = "0361-5235",

publisher = "Springer New York",

number = "1",

}

TY - JOUR

T1 - The maximum fluidity length of solidifying Sn-Cu-Ag-Ni solder alloys

AU - Gourlay, C. M.

AU - Read, J.

AU - Nogita, K.

AU - Dahle, A. K.

PY - 2008/1/1

Y1 - 2008/1/1

N2 - During wave soldering, it is important that a solder is able to flow easily to fill joints and to drain away to leave tidy fillets. The maximum fluidity length (L f) is a simple measure of the flow behavior of solidifying alloys, defined as the distance a cooling and solidifying alloy can flow in a constant cross-section before the developing microstructure arrests flow. This paper explores the influence of alloy composition on L f in Sn-rich Sn-Cu-Ag-Ni alloys with compositions relevant to wave soldering. Significant differences in L f are measured among candidate lead-free solder alloys, which are discussed with respect to the phase diagrams and the mode of solidification.

AB - During wave soldering, it is important that a solder is able to flow easily to fill joints and to drain away to leave tidy fillets. The maximum fluidity length (L f) is a simple measure of the flow behavior of solidifying alloys, defined as the distance a cooling and solidifying alloy can flow in a constant cross-section before the developing microstructure arrests flow. This paper explores the influence of alloy composition on L f in Sn-rich Sn-Cu-Ag-Ni alloys with compositions relevant to wave soldering. Significant differences in L f are measured among candidate lead-free solder alloys, which are discussed with respect to the phase diagrams and the mode of solidification.

UR - http://www.scopus.com/inward/record.url?scp=37249093525&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=37249093525&partnerID=8YFLogxK

U2 - 10.1007/s11664-007-0248-8

DO - 10.1007/s11664-007-0248-8

M3 - Article

AN - SCOPUS:37249093525

VL - 37

SP - 51

EP - 60

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

SN - 0361-5235

IS - 1

ER -

The maximum fluidity length of solidifying Sn-Cu-Ag-Ni solder alloys

Abstract

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