During wave soldering, it is important that a solder is able to flow easily to fill joints and to drain away to leave tidy fillets. The maximum fluidity length (L f) is a simple measure of the flow behavior of solidifying alloys, defined as the distance a cooling and solidifying alloy can flow in a constant cross-section before the developing microstructure arrests flow. This paper explores the influence of alloy composition on L f in Sn-rich Sn-Cu-Ag-Ni alloys with compositions relevant to wave soldering. Significant differences in L f are measured among candidate lead-free solder alloys, which are discussed with respect to the phase diagrams and the mode of solidification.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry