The overview and future prospects for planarization CMP technology

Research output: Contribution to journalReview article

Original languageEnglish
Pages (from-to)213-216
Number of pages4
JournalSeimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Volume84
Issue number3
DOIs
Publication statusPublished - Jan 1 2018

Fingerprint

Semiconductor materials
Data storage equipment

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering

Cite this

The overview and future prospects for planarization CMP technology. / Kurokawa, Syuhei.

In: Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering, Vol. 84, No. 3, 01.01.2018, p. 213-216.

Research output: Contribution to journalReview article

@article{b344fc477b4b4ff49c7c05633536d5fa,
title = "The overview and future prospects for planarization CMP technology",
author = "Syuhei Kurokawa",
year = "2018",
month = "1",
day = "1",
doi = "10.2493/jjspe.84.213",
language = "English",
volume = "84",
pages = "213--216",
journal = "Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering",
issn = "0912-0289",
publisher = "Japan Society for Precision Engineering",
number = "3",

}

TY - JOUR

T1 - The overview and future prospects for planarization CMP technology

AU - Kurokawa, Syuhei

PY - 2018/1/1

Y1 - 2018/1/1

UR - http://www.scopus.com/inward/record.url?scp=85043516367&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85043516367&partnerID=8YFLogxK

U2 - 10.2493/jjspe.84.213

DO - 10.2493/jjspe.84.213

M3 - Review article

VL - 84

SP - 213

EP - 216

JO - Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering

JF - Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering

SN - 0912-0289

IS - 3

ER -