Thermal analysis with contact resistance of packed bed by a homogenization method

Yusuke Asakuma, Tsuyoshi Yamamoto

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Effective thermal conductivity with contact resistance is analyzed by the homogenization method. This method can precisely represent the microstructure of a packed bed. In this study, the effects of parameters such as the hardness, contact pressure, roughness, temperature and particle size of the packed bed on the conductivity have been estimated to clarify the mechanism of complex packed structure. For example, heat transfer with thermal contact resistance does not dominate if the Biot number is larger than 1. Moreover, by showing results of parameters for contact resistance, applicability of homogenization method was shown for estimating the effective thermal conductivity.

Original languageEnglish
Title of host publication27th International Conference on Efficiency, Cost, Optimization, Simulation and Environmental Impact of Energy Systems, ECOS 2014
EditorsRon Zevenhoven
PublisherAabo Akademi University
ISBN (Electronic)9781634391344
Publication statusPublished - Jan 1 2014
Event27th International Conference on Efficiency, Cost, Optimization, Simulation and Environmental Impact of Energy Systems, ECOS 2014 - Turku, Finland
Duration: Jun 15 2014Jun 19 2014

Publication series

Name27th International Conference on Efficiency, Cost, Optimization, Simulation and Environmental Impact of Energy Systems, ECOS 2014
Volume2014-June

Other

Other27th International Conference on Efficiency, Cost, Optimization, Simulation and Environmental Impact of Energy Systems, ECOS 2014
CountryFinland
CityTurku
Period6/15/146/19/14

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Energy(all)

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