Thermal conduction in nanoporous copper inverse opal films

Michael T. Barako, Jeffrey M. Weisse, Shilpi Roy, Takashi Kodama, Thomas J. Dusseault, Munekazu Motoyama, Mehdi Asheghi, Fritz B. Prinz, Xiaolin Zheng, Kenneth E. Goodson

Research output: Chapter in Book/Report/Conference proceedingConference contribution

11 Citations (Scopus)

Abstract

Copper inverse opal films offer an attractive combination of conduction and convection transport properties that yield a low total thermal resistance for microfluidic heat exchanger applications. In this work, we present an integrated synthesis and characterization strategy to fabricate nanoporous copper inverse opal films and to measure the effective thermal conductivity. We synthesize inverse opal films with sub-micron pore diameters using a sacrificial packed multilayer nanosphere bed to mold the geometry of an electrodeposited copper film. We characterize the effective thermal conductivity using the 3ω method, where the nanoporous copper film is deposited directly above a microfabricated and electrically-passivated 3ω device. The effective thermal conductivity is measured to be as large as 170 W m1K1. This experimental data is compared to finite element simulations as well as common conduction models for heterogeneous media, including Maxwell's model and differential effective medium theory. This provides insight into the design of nanoengineered surfaces and two-phase vapor-venting microfluidic heat exchangers for ultrahigh heat flux cooling.

Original languageEnglish
Title of host publicationThermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages736-743
Number of pages8
ISBN (Electronic)9781479952670
DOIs
Publication statusPublished - Sep 4 2014
Externally publishedYes
Event14th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2014 - Orlando, United States
Duration: May 27 2014May 30 2014

Publication series

NameThermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Other

Other14th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2014
Country/TerritoryUnited States
CityOrlando
Period5/27/145/30/14

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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