TY - GEN
T1 - Thermal conduction in nanoporous copper inverse opal films
AU - Barako, Michael T.
AU - Weisse, Jeffrey M.
AU - Roy, Shilpi
AU - Kodama, Takashi
AU - Dusseault, Thomas J.
AU - Motoyama, Munekazu
AU - Asheghi, Mehdi
AU - Prinz, Fritz B.
AU - Zheng, Xiaolin
AU - Goodson, Kenneth E.
N1 - Publisher Copyright:
© 2014 IEEE.
PY - 2014/9/4
Y1 - 2014/9/4
N2 - Copper inverse opal films offer an attractive combination of conduction and convection transport properties that yield a low total thermal resistance for microfluidic heat exchanger applications. In this work, we present an integrated synthesis and characterization strategy to fabricate nanoporous copper inverse opal films and to measure the effective thermal conductivity. We synthesize inverse opal films with sub-micron pore diameters using a sacrificial packed multilayer nanosphere bed to mold the geometry of an electrodeposited copper film. We characterize the effective thermal conductivity using the 3ω method, where the nanoporous copper film is deposited directly above a microfabricated and electrically-passivated 3ω device. The effective thermal conductivity is measured to be as large as 170 W m1K1. This experimental data is compared to finite element simulations as well as common conduction models for heterogeneous media, including Maxwell's model and differential effective medium theory. This provides insight into the design of nanoengineered surfaces and two-phase vapor-venting microfluidic heat exchangers for ultrahigh heat flux cooling.
AB - Copper inverse opal films offer an attractive combination of conduction and convection transport properties that yield a low total thermal resistance for microfluidic heat exchanger applications. In this work, we present an integrated synthesis and characterization strategy to fabricate nanoporous copper inverse opal films and to measure the effective thermal conductivity. We synthesize inverse opal films with sub-micron pore diameters using a sacrificial packed multilayer nanosphere bed to mold the geometry of an electrodeposited copper film. We characterize the effective thermal conductivity using the 3ω method, where the nanoporous copper film is deposited directly above a microfabricated and electrically-passivated 3ω device. The effective thermal conductivity is measured to be as large as 170 W m1K1. This experimental data is compared to finite element simulations as well as common conduction models for heterogeneous media, including Maxwell's model and differential effective medium theory. This provides insight into the design of nanoengineered surfaces and two-phase vapor-venting microfluidic heat exchangers for ultrahigh heat flux cooling.
UR - http://www.scopus.com/inward/record.url?scp=84907698679&partnerID=8YFLogxK
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U2 - 10.1109/ITHERM.2014.6892354
DO - 10.1109/ITHERM.2014.6892354
M3 - Conference contribution
AN - SCOPUS:84907698679
T3 - Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
SP - 736
EP - 743
BT - Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 14th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2014
Y2 - 27 May 2014 through 30 May 2014
ER -