Thermal conductivity and natural cooling rate of excimer-laser annealed Si: A molecular dynamics study

Byoung Min Lee, Back Seok Seong, Hong Koo Baik, Shinji Munetoh, Teruaki Motooka

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    To investigate the relationship between the thermal conductivity and the cooling rate, we have performed molecular-dynamics (MD) simulations based on a combination of the Langevin and Newton equations to deal with a heat transfer from l-Si to c-Si. The thermal conductivity of c-Si was measured by the direct method. In order to deal with finite-size effects, different cell sizes perpendicular to the direction of the heat current were used. The values of the thermal conductivity of 58 W/mK and 35.7 W/mK in the Tersoff potential were obtained at 1000 K and 1500 K, respectively. A MD cell with a length of 488.75 Å in the direction of a heat flow was used for estimating the natural cooling rate. The initial c/l interface systems were obtained by setting the temperatures of the MD cell at 1000 K and 1500 K, respectively, for Z ≤ 35 Å and 3800 K for Z > 35 Å. During the natural cooling processes, the temperature of the bottom 10 Å of the MD cell was controlled. The cooling rates of 7.4×1011 K/sec for 1000 K and 5.9×1011 K/sec for 1500 K were obtained, respectively.

    Original languageEnglish
    Title of host publicationAmorphous and Polycrystalline Thin-Film Silicon Science and Technology - 2006
    Pages111-116
    Number of pages6
    Publication statusPublished - Jun 12 2007
    Event2006 MRS Spring Meeting - San Francisco, CA, United States
    Duration: Apr 18 2006Apr 20 2006

    Publication series

    NameMaterials Research Society Symposium Proceedings
    Volume910
    ISSN (Print)0272-9172

    Other

    Other2006 MRS Spring Meeting
    Country/TerritoryUnited States
    CitySan Francisco, CA
    Period4/18/064/20/06

    All Science Journal Classification (ASJC) codes

    • Materials Science(all)
    • Condensed Matter Physics
    • Mechanics of Materials
    • Mechanical Engineering

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