Thermal Deformation Analysis of Flip-Chip Devices by Moire Interferometry

Yasuyuki Morita, Kazuo Arakawa, Mitsugu Todo, Masayuki Kaneto

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

Moire interferometry technique was adopted to analyze thermal deformations of four kinds of flip-chip devices mounted on FR-4 substrate and multi-layer substrate, with and without underfill. A thermal loading was applied by heating the devices from room temperature 25°C to an elevated temperature 100°C. The experimental results showed that the underfill gave similar curvatures of silicon chip and the substrate. In the flip-chip devices mounted on the multi-layer substrate, thermal expansion coefficient mismatch between the chip and substrate was reduced, and bending deformations were decreased. The deformation of solder balls in the underfilled flip-chip device mounted on the multi-layer substrate was the least in the four kinds of flip-chip devices.

Original languageEnglish
Pages (from-to)654-659
Number of pages6
JournalJournal of The Japan Institute of Electronics Packaging
Volume5
Issue number7
DOIs
Publication statusPublished - Jan 1 2002

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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