Thermal Deformation Analysis of Flip-Chip Devices by Moire Interferometry

Yasuyuki Morita, Kazuo Arakawa, Mitsugu Todo, Masayuki Kaneto

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Moire interferometry technique was adopted to analyze thermal deformations of four kinds of flip-chip devices mounted on FR-4 substrate and multi-layer substrate, with and without underfill. A thermal loading was applied by heating the devices from room temperature 25°C to an elevated temperature 100°C. The experimental results showed that the underfill gave similar curvatures of silicon chip and the substrate. In the flip-chip devices mounted on the multi-layer substrate, thermal expansion coefficient mismatch between the chip and substrate was reduced, and bending deformations were decreased. The deformation of solder balls in the underfilled flip-chip device mounted on the multi-layer substrate was the least in the four kinds of flip-chip devices.

Original languageEnglish
Pages (from-to)654-659
Number of pages6
JournalJournal of The Japan Institute of Electronics Packaging
Volume5
Issue number7
DOIs
Publication statusPublished - Jan 1 2002

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Flip chip devices
Interferometry
Substrates
Bending (deformation)
Soldering alloys
Thermal expansion
Hot Temperature
Heating
Silicon
Temperature

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

Thermal Deformation Analysis of Flip-Chip Devices by Moire Interferometry. / Morita, Yasuyuki; Arakawa, Kazuo; Todo, Mitsugu; Kaneto, Masayuki.

In: Journal of The Japan Institute of Electronics Packaging, Vol. 5, No. 7, 01.01.2002, p. 654-659.

Research output: Contribution to journalArticle

Morita, Yasuyuki ; Arakawa, Kazuo ; Todo, Mitsugu ; Kaneto, Masayuki. / Thermal Deformation Analysis of Flip-Chip Devices by Moire Interferometry. In: Journal of The Japan Institute of Electronics Packaging. 2002 ; Vol. 5, No. 7. pp. 654-659.
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