Thermal expansion of Cu6Sn5 and (Cu,Ni) 6Sn5

Dekui Mu, Jonathan Read, Yafeng Yang, Kazuhiro Nogita

Research output: Contribution to journalArticlepeer-review

49 Citations (Scopus)

Abstract

Cu6Sn5 is a common intermetallic compound formed during electrical packaging. It has an allotropic transformation from the low-temperature monoclinic η′-Cu6Sn5 to high-temperature hexagonal η-Cu6Sn5 at equilibrium temperature 186 °C. In this research, the effects of this allotropic transformation and Ni addition on the thermal expansion of η′- and/or η-Cu6Sn5 were characterized using synchrotron x-ray diffraction and dilatometry. A volume expansion during the monoclinic to hexagonal transformation was found. The addition of Ni was found to decrease the undesirable thermal expansion by stabilizing the hexagonal Cu 6Sn5 at temperatures below 186 °C and reducing the overall thermal expansion of Cu6Sn5.

Original languageEnglish
Pages (from-to)2660-2664
Number of pages5
JournalJournal of Materials Research
Volume26
Issue number20
DOIs
Publication statusPublished - Oct 28 2011

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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