Thermal imaging technology using a thermoelectric infrared sensor

masaki Hirota, Yoshimi Ohta, Yasuhiro Fukuyama, Masafumi Tsuji, Masanori Saito

Research output: Contribution to conferencePaper

Abstract

This paper describes a low-cost 48 × 48 element thermal imaging camera intended for use in measuring the temperature in a car interior for advanced air conditioning systems. The compact camera measures 46 × 46 × 60 mm. It operates under a program stored in the central processing unit and can measure the interior temperature distribution with an accuracy of ±0.7°C in range from 0 to 40°C. The camera includes a thermoelectric focal plane array (FPA) housed in a low-cost vacuum-sealed package. The FPA is fabricated with the conventional IC manufacturing process and micromachining technology. The chip is 6.5 × 6.5 mm in size and achieves high sensitivity of 4,300 V/W, which is higher than the performance reported for any other thermopile. This high performance has been achieved by optimizing the sensor's thermal isolation structure and a precisely patterned Au-black absorber that attains high infrared absorptivity of more than 90%. The package incorporates a wide-angle zinc sulfide (ZnS) lens that is fabricated using moulding technology. The field of view is 60 deg. by 60 deg. The performance of the sensor is suitable for measuring car interior temperatures.

Original languageEnglish
DOIs
Publication statusPublished - Dec 1 2008
Externally publishedYes
Event2008 World Congress - Detroit, MI, United States
Duration: Apr 14 2008Apr 17 2008

Other

Other2008 World Congress
CountryUnited States
CityDetroit, MI
Period4/14/084/17/08

Fingerprint

Infrared imaging
Focal plane arrays
Cameras
Infrared radiation
Sensors
Railroad cars
Thermopiles
Zinc sulfide
Interiors (building)
Micromachining
Air conditioning
Molding
Program processors
Costs
Lenses
Temperature distribution
Vacuum
Temperature

All Science Journal Classification (ASJC) codes

  • Automotive Engineering
  • Safety, Risk, Reliability and Quality
  • Pollution
  • Industrial and Manufacturing Engineering

Cite this

Hirota, M., Ohta, Y., Fukuyama, Y., Tsuji, M., & Saito, M. (2008). Thermal imaging technology using a thermoelectric infrared sensor. Paper presented at 2008 World Congress, Detroit, MI, United States. https://doi.org/10.4271/2008-01-0912

Thermal imaging technology using a thermoelectric infrared sensor. / Hirota, masaki; Ohta, Yoshimi; Fukuyama, Yasuhiro; Tsuji, Masafumi; Saito, Masanori.

2008. Paper presented at 2008 World Congress, Detroit, MI, United States.

Research output: Contribution to conferencePaper

Hirota, M, Ohta, Y, Fukuyama, Y, Tsuji, M & Saito, M 2008, 'Thermal imaging technology using a thermoelectric infrared sensor' Paper presented at 2008 World Congress, Detroit, MI, United States, 4/14/08 - 4/17/08, . https://doi.org/10.4271/2008-01-0912
Hirota M, Ohta Y, Fukuyama Y, Tsuji M, Saito M. Thermal imaging technology using a thermoelectric infrared sensor. 2008. Paper presented at 2008 World Congress, Detroit, MI, United States. https://doi.org/10.4271/2008-01-0912
Hirota, masaki ; Ohta, Yoshimi ; Fukuyama, Yasuhiro ; Tsuji, Masafumi ; Saito, Masanori. / Thermal imaging technology using a thermoelectric infrared sensor. Paper presented at 2008 World Congress, Detroit, MI, United States.
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