Thermodynamic modelling of a solid state thermoelectric cooling device: Temperature-entropy analysis

A. Chakraborty, B. B. Saha, S. Koyama, K. C. Ng

    Research output: Contribution to journalArticlepeer-review

    59 Citations (Scopus)

    Abstract

    This article presents the temperature-entropy analysis, where the Thomson effect bridges the Joule heat and the Fourier heat across the thermoelectric elements of a thermoelectric cooling cycle to describe the principal energy flows and performance bottlenecks or dissipations. Starting from the principles of thermodynamics of thermoelectricity, differential governing equations describing the energy and entropy flows of the thermoelectric element are discussed. The temperature-entropy (T-S) profile in a single Peltier element is pictured for temperature dependent Seebeck coefficient and illustrated with data from commercial available thermoelectric cooler.

    Original languageEnglish
    Pages (from-to)3547-3554
    Number of pages8
    JournalInternational Journal of Heat and Mass Transfer
    Volume49
    Issue number19-20
    DOIs
    Publication statusPublished - Sep 2006

    All Science Journal Classification (ASJC) codes

    • Condensed Matter Physics
    • Mechanical Engineering
    • Fluid Flow and Transfer Processes

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