Thermodynamic modelling of a solid state thermoelectric cooling device: Temperature-entropy analysis

A. Chakraborty, Bidyut Baran Saha, Shigeru Koyama, K. C. Ng

Research output: Contribution to journalArticle

54 Citations (Scopus)

Abstract

This article presents the temperature-entropy analysis, where the Thomson effect bridges the Joule heat and the Fourier heat across the thermoelectric elements of a thermoelectric cooling cycle to describe the principal energy flows and performance bottlenecks or dissipations. Starting from the principles of thermodynamics of thermoelectricity, differential governing equations describing the energy and entropy flows of the thermoelectric element are discussed. The temperature-entropy (T-S) profile in a single Peltier element is pictured for temperature dependent Seebeck coefficient and illustrated with data from commercial available thermoelectric cooler.

Original languageEnglish
Pages (from-to)3547-3554
Number of pages8
JournalInternational Journal of Heat and Mass Transfer
Volume49
Issue number19-20
DOIs
Publication statusPublished - Sep 1 2006

Fingerprint

thermoelectric cooling
thermoelectricity
Entropy
Thermodynamics
entropy
Cooling
solid state
thermodynamics
Thermoelectricity
heat
Seebeck coefficient
Seebeck effect
coolers
Temperature
temperature
Differential equations
differential equations
dissipation
cycles
energy

All Science Journal Classification (ASJC) codes

  • Fluid Flow and Transfer Processes
  • Energy(all)
  • Mechanical Engineering

Cite this

Thermodynamic modelling of a solid state thermoelectric cooling device : Temperature-entropy analysis. / Chakraborty, A.; Saha, Bidyut Baran; Koyama, Shigeru; Ng, K. C.

In: International Journal of Heat and Mass Transfer, Vol. 49, No. 19-20, 01.09.2006, p. 3547-3554.

Research output: Contribution to journalArticle

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