Thomson scattering diagnostic system for measurement of electron properties of processing plasmas

M. D. Bowden, Y. Goto, H. Yanaga, P. J.A. Howarth, Kiichiro Uchino, K. Muraoka

Research output: Contribution to journalArticle

22 Citations (Scopus)

Abstract

In recent years, the method of incoherent Thomson scattering has been used in the study of glow discharge plasmas to measure electron properties such as electron density and electron temperature. In this paper, we report the development of a Thomson scattering diagnostic system that is appropriate for measurements in glow discharges containing reactive chemical species. The new scattering system is based on a low-pulse-energy, high-repetition-rate YAG laser, a multipass cell for the laser beam, and an ICCD camera for simultaneous detection of the entire scattered spectrum. Measurements made in an electron cyclotron resonance plasma using the new system are presented. The lower detection limit of electron density is estimated to be 5×1016 m-3.

Original languageEnglish
Pages (from-to)203-209
Number of pages7
JournalPlasma Sources Science and Technology
Volume8
Issue number2
DOIs
Publication statusPublished - May 1 1999

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Thomson scattering
glow discharges
incoherent scattering
electron cyclotron resonance
YAG lasers
repetition
electrons
cameras
laser beams
electron energy
pulses
cells
scattering
temperature
energy

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics

Cite this

Thomson scattering diagnostic system for measurement of electron properties of processing plasmas. / Bowden, M. D.; Goto, Y.; Yanaga, H.; Howarth, P. J.A.; Uchino, Kiichiro; Muraoka, K.

In: Plasma Sources Science and Technology, Vol. 8, No. 2, 01.05.1999, p. 203-209.

Research output: Contribution to journalArticle

Bowden, M. D. ; Goto, Y. ; Yanaga, H. ; Howarth, P. J.A. ; Uchino, Kiichiro ; Muraoka, K. / Thomson scattering diagnostic system for measurement of electron properties of processing plasmas. In: Plasma Sources Science and Technology. 1999 ; Vol. 8, No. 2. pp. 203-209.
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