Three-dimensional integration of optical multi-chips using surface-activated bonding for high-density microsystems packaging

Eiji Higurashi, Daisuke Chino, Tadatomo Suga, Renshi Sawada

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    1 Citation (Scopus)

    Abstract

    The hybrid integration of multiple chips in three dimensions is an important technology for realizing highly functional, compact optoelectronic microsystems. In this study, three-dimensional integration of optical chips was successfully performed using Au-Au surface-activated bonding (bonding temperature: 150 °C). The fabricated microsystem consists of two elements: i) a micromachined silicon optical bench incorporating a bonded laser diode, micromirrors, and through-hole electrodes; and ii) a glass substrate incorporating bonded photodiodes, electrical interconnections, and refractive microlenses. The silicon optical bench and the glass substrate were vertically stacked by surface-activated bonding. The size of the fully integrated microsystem is only 2.6 mm × 2.6 mm × 1 mm thick. The design and fabrication process allow chip-scale and wafer-level packaging. In addition, application for laser Doppler velocimeter sensor is discussed.

    Original languageEnglish
    Title of host publication2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS
    Pages62-63
    Number of pages2
    DOIs
    Publication statusPublished - Oct 23 2008
    Event2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS - Freiburg, Germany
    Duration: Aug 11 2008Aug 14 2008

    Publication series

    Name2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS

    Other

    Other2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS
    Country/TerritoryGermany
    CityFreiburg
    Period8/11/088/14/08

    All Science Journal Classification (ASJC) codes

    • Electrical and Electronic Engineering

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