Three-dimensional integration of optical multi-chips using surface-activated bonding for high-density microsystems packaging

Eiji Higurashi, Daisuke Chino, Tadatomo Suga, Renshi Sawada

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The hybrid integration of multiple chips in three dimensions is an important technology for realizing highly functional, compact optoelectronic microsystems. In this study, three-dimensional integration of optical chips was successfully performed using Au-Au surface-activated bonding (bonding temperature: 150 °C). The fabricated microsystem consists of two elements: i) a micromachined silicon optical bench incorporating a bonded laser diode, micromirrors, and through-hole electrodes; and ii) a glass substrate incorporating bonded photodiodes, electrical interconnections, and refractive microlenses. The silicon optical bench and the glass substrate were vertically stacked by surface-activated bonding. The size of the fully integrated microsystem is only 2.6 mm × 2.6 mm × 1 mm thick. The design and fabrication process allow chip-scale and wafer-level packaging. In addition, application for laser Doppler velocimeter sensor is discussed.

Original languageEnglish
Title of host publication2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS
Pages62-63
Number of pages2
DOIs
Publication statusPublished - Oct 23 2008
Event2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS - Freiburg, Germany
Duration: Aug 11 2008Aug 14 2008

Publication series

Name2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS

Other

Other2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS
CountryGermany
CityFreiburg
Period8/11/088/14/08

Fingerprint

Microsystems
Packaging
Microlenses
Laser Doppler velocimeters
Glass
Silicon
Substrates
Photodiodes
Optoelectronic devices
Semiconductor lasers
Fabrication
Electrodes
Sensors
Temperature

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

Higurashi, E., Chino, D., Suga, T., & Sawada, R. (2008). Three-dimensional integration of optical multi-chips using surface-activated bonding for high-density microsystems packaging. In 2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS (pp. 62-63). [4607829] (2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS). https://doi.org/10.1109/OMEMS.2008.4607829

Three-dimensional integration of optical multi-chips using surface-activated bonding for high-density microsystems packaging. / Higurashi, Eiji; Chino, Daisuke; Suga, Tadatomo; Sawada, Renshi.

2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS. 2008. p. 62-63 4607829 (2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Higurashi, E, Chino, D, Suga, T & Sawada, R 2008, Three-dimensional integration of optical multi-chips using surface-activated bonding for high-density microsystems packaging. in 2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS., 4607829, 2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS, pp. 62-63, 2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS, Freiburg, Germany, 8/11/08. https://doi.org/10.1109/OMEMS.2008.4607829
Higurashi E, Chino D, Suga T, Sawada R. Three-dimensional integration of optical multi-chips using surface-activated bonding for high-density microsystems packaging. In 2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS. 2008. p. 62-63. 4607829. (2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS). https://doi.org/10.1109/OMEMS.2008.4607829
Higurashi, Eiji ; Chino, Daisuke ; Suga, Tadatomo ; Sawada, Renshi. / Three-dimensional integration of optical multi-chips using surface-activated bonding for high-density microsystems packaging. 2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS. 2008. pp. 62-63 (2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS).
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