Abstract
The hybrid integration of multiple chips in three dimensions is an important technology for realizing highly functional, compact optoelectronic microsystems. In this study, three-dimensional integration of optical chips was successfully performed using Au-Au surface-activated bonding (bonding temperature: 150 °C). The fabricated microsystem consists of two elements: i) a micromachined silicon optical bench incorporating a bonded laser diode, micromirrors, and through-hole electrodes; and ii) a glass substrate incorporating bonded photodiodes, electrical interconnections, and refractive microlenses. The silicon optical bench and the glass substrate were vertically stacked by surface-activated bonding. The size of the fully integrated microsystem is only 2.6 mm × 2.6 mm × 1 mm thick. The design and fabrication process allow chip-scale and wafer-level packaging. In addition, application for laser Doppler velocimeter sensor is discussed.
| Original language | English |
|---|---|
| Title of host publication | 2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS |
| Pages | 62-63 |
| Number of pages | 2 |
| DOIs | |
| Publication status | Published - Oct 23 2008 |
| Event | 2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS - Freiburg, Germany Duration: Aug 11 2008 → Aug 14 2008 |
Publication series
| Name | 2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS |
|---|
Other
| Other | 2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS |
|---|---|
| Country | Germany |
| City | Freiburg |
| Period | 8/11/08 → 8/14/08 |
Fingerprint
All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering
Cite this
Three-dimensional integration of optical multi-chips using surface-activated bonding for high-density microsystems packaging. / Higurashi, Eiji; Chino, Daisuke; Suga, Tadatomo; Sawada, Renshi.
2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS. 2008. p. 62-63 4607829 (2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Three-dimensional integration of optical multi-chips using surface-activated bonding for high-density microsystems packaging
AU - Higurashi, Eiji
AU - Chino, Daisuke
AU - Suga, Tadatomo
AU - Sawada, Renshi
PY - 2008/10/23
Y1 - 2008/10/23
N2 - The hybrid integration of multiple chips in three dimensions is an important technology for realizing highly functional, compact optoelectronic microsystems. In this study, three-dimensional integration of optical chips was successfully performed using Au-Au surface-activated bonding (bonding temperature: 150 °C). The fabricated microsystem consists of two elements: i) a micromachined silicon optical bench incorporating a bonded laser diode, micromirrors, and through-hole electrodes; and ii) a glass substrate incorporating bonded photodiodes, electrical interconnections, and refractive microlenses. The silicon optical bench and the glass substrate were vertically stacked by surface-activated bonding. The size of the fully integrated microsystem is only 2.6 mm × 2.6 mm × 1 mm thick. The design and fabrication process allow chip-scale and wafer-level packaging. In addition, application for laser Doppler velocimeter sensor is discussed.
AB - The hybrid integration of multiple chips in three dimensions is an important technology for realizing highly functional, compact optoelectronic microsystems. In this study, three-dimensional integration of optical chips was successfully performed using Au-Au surface-activated bonding (bonding temperature: 150 °C). The fabricated microsystem consists of two elements: i) a micromachined silicon optical bench incorporating a bonded laser diode, micromirrors, and through-hole electrodes; and ii) a glass substrate incorporating bonded photodiodes, electrical interconnections, and refractive microlenses. The silicon optical bench and the glass substrate were vertically stacked by surface-activated bonding. The size of the fully integrated microsystem is only 2.6 mm × 2.6 mm × 1 mm thick. The design and fabrication process allow chip-scale and wafer-level packaging. In addition, application for laser Doppler velocimeter sensor is discussed.
UR - http://www.scopus.com/inward/record.url?scp=54049136149&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=54049136149&partnerID=8YFLogxK
U2 - 10.1109/OMEMS.2008.4607829
DO - 10.1109/OMEMS.2008.4607829
M3 - Conference contribution
AN - SCOPUS:54049136149
SN - 9781424419180
T3 - 2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS
SP - 62
EP - 63
BT - 2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS
ER -