Time evolution of strain distribution during ultrasonic bonding of Cu wire: Impact of bonding temperature

Mamoru Sakamoto, Kenichi Nakadozono, Keiichiro Iwanabe, Tanemasa Asano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Impact of bonding temperature on bonding dynamics in the ultrasonic bonding of Cu FAB (free air ball) is investigated by measuring dynamic strain with piezoresistive strain sensor. The strain sensor was composed of an array of pairs of n-and p-type strain gauges to determine the strains along two axes, the axis of ultrasonic motion and the axis perpendicular to the surface of the substrate. Au wire bonding was also investigated for comparison. The substrate temperature was changed from room temperature to 150°C. It is clearly observed that deformation of FAB is accelerated by elevating the substrate temperature. Most of the deformation of FAB is found to be completed within several milliseconds after the start of the bonding operation. For the case of Au FAB bonding, significant reduction of residual strain was observed at 150°C.

Original languageEnglish
Title of host publicationEMPC 2017 - 21st European Microelectronics and Packaging Conference and Exhibition
EditorsAndrzej Dziedzic, Piotr Jasinski
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-5
Number of pages5
ISBN (Electronic)9780956808646
DOIs
Publication statusPublished - Apr 24 2018
Event21st European Microelectronics and Packaging Conference and Exhibition, EMPC 2017 - Warsaw, Poland
Duration: Sep 10 2017Sep 13 2017

Publication series

NameEMPC 2017 - 21st European Microelectronics and Packaging Conference and Exhibition
Volume2018-January

Other

Other21st European Microelectronics and Packaging Conference and Exhibition, EMPC 2017
CountryPoland
CityWarsaw
Period9/10/179/13/17

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films

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