Time evolution of strain distribution under bonding pad during ultrasonic wire-bonding at 200°C

Mamoru Sakamoto, Kenichi Nakadozono, Keiichiro Iwanabe, Tanemasa Asano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Bonding dynamics during ultrasonic bonding of Cu free air ball (FAB) is investigated by measuring dynamic strain with piezoresistive strain sensor. Change in dynamic strain with elevating substrate temperature up to 200°C was investigated. It was clearly observed that elevating substrate temperature significantly enhanced deformation of the Cu FAB while the application of pressing load and ultrasonic vibration. Visualization of the average strain clearly indicated that concentration of strain in the device layer at the positon over which the end of capillary was present was reduced. Therefore, elevating substrate temperature may reduce generation of damage in the device layer. It was also found that elevating substrate temperature reduced the residual strain in the device layer.

Original languageEnglish
Title of host publication2017 IEEE CPMT Symposium Japan, ICSJ 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages149-152
Number of pages4
ISBN (Electronic)9781538627129
DOIs
Publication statusPublished - Dec 26 2017
Event2017 IEEE CPMT Symposium Japan, ICSJ 2017 - Kyoto, Japan
Duration: Nov 20 2017Nov 22 2017

Publication series

Name2017 IEEE CPMT Symposium Japan, ICSJ 2017
Volume2017-January

Other

Other2017 IEEE CPMT Symposium Japan, ICSJ 2017
CountryJapan
CityKyoto
Period11/20/1711/22/17

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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