Tin whisker formation on a lead-free solder alloy studied by transmission electron microscopy

H. Sosiati, N. Kuwano, Satoshi Hata, Y. Iwane, Y. Morizono, Y. Ohno

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

Tin whiskers grown on a Sn/Cu-plated Polyimide (PI)-flexible substrate are a serious problem in electronic industrial application, because the whiskers lead to catastrophic electrical short circuit failures. Here, we report characterization of microstructures in the whiskers grown on a surface of Sn/Cu-plated PI-flexible substrate by cross-sectional transmission electron microscopy (TEM) to analyze the behavior and the formation mechanism of whiskers. The whisker was found to be monocrystalline β-Sn and grown with the preferred directions of [110] and [101]. The whiskers formed on this tin surface are nucleated and grown by the compressive stress, that is induced externally by insertion of Sn/Cu-plated PI-flexible substrate into the connector.

Original languageEnglish
Title of host publication2006 8th Electronics Packaging Technology Conference, EPTC
Pages398-403
Number of pages6
DOIs
Publication statusPublished - 2006
Event2006 8th Electronics Packaging Technology Conference, EPTC - , Singapore
Duration: Dec 6 2006Dec 8 2006

Other

Other2006 8th Electronics Packaging Technology Conference, EPTC
CountrySingapore
Period12/6/0612/8/06

    Fingerprint

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Sosiati, H., Kuwano, N., Hata, S., Iwane, Y., Morizono, Y., & Ohno, Y. (2006). Tin whisker formation on a lead-free solder alloy studied by transmission electron microscopy. In 2006 8th Electronics Packaging Technology Conference, EPTC (pp. 398-403). [4147278] https://doi.org/10.1109/EPTC.2006.342749