Tin whisker formation on a lead-free solder alloy studied by transmission electron microscopy

H. Sosiati, N. Kuwano, S. Hata, Y. Iwane, Y. Morizono, Y. Ohno

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

Tin whiskers grown on a Sn/Cu-plated Polyimide (PI)-flexible substrate are a serious problem in electronic industrial application, because the whiskers lead to catastrophic electrical short circuit failures. Here, we report characterization of microstructures in the whiskers grown on a surface of Sn/Cu-plated PI-flexible substrate by cross-sectional transmission electron microscopy (TEM) to analyze the behavior and the formation mechanism of whiskers. The whisker was found to be monocrystalline β-Sn and grown with the preferred directions of [110] and [101]. The whiskers formed on this tin surface are nucleated and grown by the compressive stress, that is induced externally by insertion of Sn/Cu-plated PI-flexible substrate into the connector.

Original languageEnglish
Title of host publication2006 8th Electronics Packaging Technology Conference, EPTC
Pages398-403
Number of pages6
DOIs
Publication statusPublished - 2006
Event2006 8th Electronics Packaging Technology Conference, EPTC - , Singapore
Duration: Dec 6 2006Dec 8 2006

Publication series

NameProceedings of the Electronic Packaging Technology Conference, EPTC

Other

Other2006 8th Electronics Packaging Technology Conference, EPTC
CountrySingapore
Period12/6/0612/8/06

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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