Tougher ultrafine grain Cu via high-angle grain boundaries and low dislocation density

Y. H. Zhao, J. F. Bingert, Y. T. Zhu, X. Z. Liao, R. Z. Valiev, Z. Horita, T. G. Langdon, Y. Z. Zhou, E. J. Lavernia

    Research output: Contribution to journalArticlepeer-review

    175 Citations (Scopus)

    Abstract

    Although there are a few isolated examples of excellent strength and ductility in single-phase metals with ultrafine grained (UFG) structures, the precise role of different microstructural features responsible for these results is not fully understood. Here, we demonstrate that a large fraction of high-angle grain boundaries and a low dislocation density may significantly improve the toughness and uniform elongation of UFG Cu by increasing its strain-hardening rate without any concomitant sacrifice in its yield strength. Our study provides a strategy for synthesizing tough UFG materials.

    Original languageEnglish
    Article number081903
    JournalApplied Physics Letters
    Volume92
    Issue number8
    DOIs
    Publication statusPublished - 2008

    All Science Journal Classification (ASJC) codes

    • Physics and Astronomy (miscellaneous)

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