Tougher ultrafine grain Cu via high-angle grain boundaries and low dislocation density

Y. H. Zhao, J. F. Bingert, Y. T. Zhu, X. Z. Liao, R. Z. Valiev, Z. Horita, T. G. Langdon, Y. Z. Zhou, E. J. Lavernia

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Abstract

Although there are a few isolated examples of excellent strength and ductility in single-phase metals with ultrafine grained (UFG) structures, the precise role of different microstructural features responsible for these results is not fully understood. Here, we demonstrate that a large fraction of high-angle grain boundaries and a low dislocation density may significantly improve the toughness and uniform elongation of UFG Cu by increasing its strain-hardening rate without any concomitant sacrifice in its yield strength. Our study provides a strategy for synthesizing tough UFG materials.

Original languageEnglish
Article number081903
JournalApplied Physics Letters
Volume92
Issue number8
DOIs
Publication statusPublished - Mar 6 2008

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy (miscellaneous)

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    Zhao, Y. H., Bingert, J. F., Zhu, Y. T., Liao, X. Z., Valiev, R. Z., Horita, Z., Langdon, T. G., Zhou, Y. Z., & Lavernia, E. J. (2008). Tougher ultrafine grain Cu via high-angle grain boundaries and low dislocation density. Applied Physics Letters, 92(8), [081903]. https://doi.org/10.1063/1.2870014