Transient analysis of an advanced adsorption cooling device employing copper-sputtered silica-gel and water pair

Anutosh Chakraborty, Bidyut Baran Saha, Kim Choon Ng, Jingming He, Ibrahim Ibrahim El-Sharkawy, Shigeru Koyama

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This article presents the transient analysis of an advanced adsorption cooling device utilizing copper sputtered silica-gel as adsorbent and water as adsorbate, which is based on the experimentally confirmed adsorption isotherms and kinetics data so that an innovative and interesting solid sorption cooler can be developed for micro-electronics cooling purposes. In this paper, we also furnish the adsorption isotherms and kinetics data of copper sputtered silica-gel and water systems. A detailed transient computer simulation has been conducted to calculate its performances in terms of cooling capacity for various heat source temperatures and a constant heat sink temperature of 30 °C. It is found that the proposed innovative cooling cycle yields a cooling capacity up to 20 Watt per cm2, and is operated effectively by low-grade waste heat sources of temperature as low as 60 °C. Another noteworthy finding is that, the load surface temperature is able to achieve 20 °C for the cooling capacity of 10 Watt/cm2.

Original languageEnglish
Title of host publication4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009
PublisherNational Taipei University of Technology
Pages293-298
Number of pages6
ISBN (Print)9868509610, 9789868509610
Publication statusPublished - 2009
Event4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009 - Taipei, Taiwan, Province of China
Duration: May 20 2009May 22 2009

Publication series

Name4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009

Other

Other4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009
CountryTaiwan, Province of China
CityTaipei
Period5/20/095/22/09

All Science Journal Classification (ASJC) codes

  • Chemical Engineering (miscellaneous)

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  • Cite this

    Chakraborty, A., Saha, B. B., Ng, K. C., He, J., El-Sharkawy, I. I., & Koyama, S. (2009). Transient analysis of an advanced adsorption cooling device employing copper-sputtered silica-gel and water pair. In 4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009 (pp. 293-298). (4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009). National Taipei University of Technology.