Transient analysis of an advanced adsorption cooling device employing copper-sputtered silica-gel and water pair

Anutosh Chakraborty, Bidyut Baran Saha, Kim Choon Ng, Jingming He, Ibrahim Ibrahim El-Sharkawy, Shigeru Koyama

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    This article presents the transient analysis of an advanced adsorption cooling device utilizing copper sputtered silica-gel as adsorbent and water as adsorbate, which is based on the experimentally confirmed adsorption isotherms and kinetics data so that an innovative and interesting solid sorption cooler can be developed for micro-electronics cooling purposes. In this paper, we also furnish the adsorption isotherms and kinetics data of copper sputtered silica-gel and water systems. A detailed transient computer simulation has been conducted to calculate its performances in terms of cooling capacity for various heat source temperatures and a constant heat sink temperature of 30 °C. It is found that the proposed innovative cooling cycle yields a cooling capacity up to 20 Watt per cm2, and is operated effectively by low-grade waste heat sources of temperature as low as 60 °C. Another noteworthy finding is that, the load surface temperature is able to achieve 20 °C for the cooling capacity of 10 Watt/cm2.

    Original languageEnglish
    Title of host publication4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009
    PublisherNational Taipei University of Technology
    Pages293-298
    Number of pages6
    ISBN (Print)9868509610, 9789868509610
    Publication statusPublished - Jan 1 2009
    Event4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009 - Taipei, Taiwan, Province of China
    Duration: May 20 2009May 22 2009

    Publication series

    Name4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009

    Other

    Other4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009
    CountryTaiwan, Province of China
    CityTaipei
    Period5/20/095/22/09

    Fingerprint

    Silica Gel
    Silica gel
    Transient analysis
    Copper
    Cooling
    Adsorption
    Water
    Adsorption isotherms
    Electronic cooling
    Temperature
    Kinetics
    Waste heat
    Heat sinks
    Adsorbates
    Microelectronics
    Adsorbents
    Sorption
    Computer simulation

    All Science Journal Classification (ASJC) codes

    • Chemical Engineering (miscellaneous)

    Cite this

    Chakraborty, A., Saha, B. B., Ng, K. C., He, J., El-Sharkawy, I. I., & Koyama, S. (2009). Transient analysis of an advanced adsorption cooling device employing copper-sputtered silica-gel and water pair. In 4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009 (pp. 293-298). (4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009). National Taipei University of Technology.

    Transient analysis of an advanced adsorption cooling device employing copper-sputtered silica-gel and water pair. / Chakraborty, Anutosh; Saha, Bidyut Baran; Ng, Kim Choon; He, Jingming; El-Sharkawy, Ibrahim Ibrahim; Koyama, Shigeru.

    4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009. National Taipei University of Technology, 2009. p. 293-298 (4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Chakraborty, A, Saha, BB, Ng, KC, He, J, El-Sharkawy, II & Koyama, S 2009, Transient analysis of an advanced adsorption cooling device employing copper-sputtered silica-gel and water pair. in 4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009. 4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009, National Taipei University of Technology, pp. 293-298, 4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009, Taipei, Taiwan, Province of China, 5/20/09.
    Chakraborty A, Saha BB, Ng KC, He J, El-Sharkawy II, Koyama S. Transient analysis of an advanced adsorption cooling device employing copper-sputtered silica-gel and water pair. In 4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009. National Taipei University of Technology. 2009. p. 293-298. (4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009).
    Chakraborty, Anutosh ; Saha, Bidyut Baran ; Ng, Kim Choon ; He, Jingming ; El-Sharkawy, Ibrahim Ibrahim ; Koyama, Shigeru. / Transient analysis of an advanced adsorption cooling device employing copper-sputtered silica-gel and water pair. 4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009. National Taipei University of Technology, 2009. pp. 293-298 (4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009).
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    AU - He, Jingming

    AU - El-Sharkawy, Ibrahim Ibrahim

    AU - Koyama, Shigeru

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