Transient-liquid-phase and liquid-film-assisted joining of ceramics

Joshua D. Sugar; Joseph T. McKeown; Takaya Akashi; Sung M. Hong; Kunihiko Nakashima; Andreas M. Glaeser

doi:10.1016/j.jeurceramsoc.2005.06.034

Transient-liquid-phase and liquid-film-assisted joining of ceramics

Joshua D. Sugar, Joseph T. McKeown, Takaya Akashi, Sung M. Hong, Kunihiko Nakashima, Andreas M. Glaeser

Research output: Contribution to journal › Article › peer-review

55 Citations (Scopus)

Abstract

Two joining methods, transient-liquid-phase (TLP) joining and liquid-film-assisted joining (LFAJ), have been used to bond alumina ceramics. Both methods rely on multilayer metallic interlayers designed to form thin liquid films at reduced temperatures. The liquid films either disappear by interdiffusion (TLP) or promote ceramic/metal interface formation and concurrent dewetting of the liquid film (LFAJ). Progress on extending the TLP method to lower temperatures by combining low-melting-point (<450 °C) liquids and commercial reactive-metal brazes is described. Recent LFAJ work on joining alumina to niobium using copper films is presented.

Original language	English
Pages (from-to)	363-372
Number of pages	10
Journal	Journal of the European Ceramic Society
Volume	26
Issue number	4-5
DOIs	https://doi.org/10.1016/j.jeurceramsoc.2005.06.034
Publication status	Published - 2006

All Science Journal Classification (ASJC) codes

Ceramics and Composites
Materials Chemistry

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10.1016/j.jeurceramsoc.2005.06.034

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@article{7a736cb82340416e9a2b58966d2b54be,

title = "Transient-liquid-phase and liquid-film-assisted joining of ceramics",

abstract = "Two joining methods, transient-liquid-phase (TLP) joining and liquid-film-assisted joining (LFAJ), have been used to bond alumina ceramics. Both methods rely on multilayer metallic interlayers designed to form thin liquid films at reduced temperatures. The liquid films either disappear by interdiffusion (TLP) or promote ceramic/metal interface formation and concurrent dewetting of the liquid film (LFAJ). Progress on extending the TLP method to lower temperatures by combining low-melting-point (<450 °C) liquids and commercial reactive-metal brazes is described. Recent LFAJ work on joining alumina to niobium using copper films is presented.",

author = "Sugar, {Joshua D.} and McKeown, {Joseph T.} and Takaya Akashi and Hong, {Sung M.} and Kunihiko Nakashima and Glaeser, {Andreas M.}",

note = "Funding Information: This research was supported by the Director, Office of Science, Office of Basic Energy Sciences, Division of Materials Science and Engineering, of the U.S. Department of Energy under Contract No. DE-AC03-76SF00098. Takaya Akashi acknowledges support from a one-year fellowship from the Japanese Ministry of Education, Culture, Sports, Science and Technology. Sung Hong acknowledges support in the form of a Jane Lewis Fellowship. A.M. Glaeser wishes to thank the Japan Society for the Promotion of Science for an Invitation Fellowship for Research in Japan during which some of the ideas in this paper were formulated.",

year = "2006",

doi = "10.1016/j.jeurceramsoc.2005.06.034",

language = "English",

volume = "26",

pages = "363--372",

journal = "Journal of the European Ceramic Society",

issn = "0955-2219",

publisher = "Elsevier BV",

number = "4-5",

}

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T1 - Transient-liquid-phase and liquid-film-assisted joining of ceramics

AU - Sugar, Joshua D.

AU - McKeown, Joseph T.

AU - Akashi, Takaya

AU - Hong, Sung M.

AU - Nakashima, Kunihiko

AU - Glaeser, Andreas M.

N1 - Funding Information: This research was supported by the Director, Office of Science, Office of Basic Energy Sciences, Division of Materials Science and Engineering, of the U.S. Department of Energy under Contract No. DE-AC03-76SF00098. Takaya Akashi acknowledges support from a one-year fellowship from the Japanese Ministry of Education, Culture, Sports, Science and Technology. Sung Hong acknowledges support in the form of a Jane Lewis Fellowship. A.M. Glaeser wishes to thank the Japan Society for the Promotion of Science for an Invitation Fellowship for Research in Japan during which some of the ideas in this paper were formulated.

PY - 2006

Y1 - 2006

N2 - Two joining methods, transient-liquid-phase (TLP) joining and liquid-film-assisted joining (LFAJ), have been used to bond alumina ceramics. Both methods rely on multilayer metallic interlayers designed to form thin liquid films at reduced temperatures. The liquid films either disappear by interdiffusion (TLP) or promote ceramic/metal interface formation and concurrent dewetting of the liquid film (LFAJ). Progress on extending the TLP method to lower temperatures by combining low-melting-point (<450 °C) liquids and commercial reactive-metal brazes is described. Recent LFAJ work on joining alumina to niobium using copper films is presented.

AB - Two joining methods, transient-liquid-phase (TLP) joining and liquid-film-assisted joining (LFAJ), have been used to bond alumina ceramics. Both methods rely on multilayer metallic interlayers designed to form thin liquid films at reduced temperatures. The liquid films either disappear by interdiffusion (TLP) or promote ceramic/metal interface formation and concurrent dewetting of the liquid film (LFAJ). Progress on extending the TLP method to lower temperatures by combining low-melting-point (<450 °C) liquids and commercial reactive-metal brazes is described. Recent LFAJ work on joining alumina to niobium using copper films is presented.

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JO - Journal of the European Ceramic Society

JF - Journal of the European Ceramic Society

IS - 4-5

ER -

Transient-liquid-phase and liquid-film-assisted joining of ceramics

Abstract

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