Transient-liquid-phase and liquid-film-assisted joining of ceramics

Joshua D. Sugar, Joseph T. McKeown, Takaya Akashi, Sung M. Hong, Kunihiko Nakashima, Andreas M. Glaeser

Research output: Contribution to journalArticle

48 Citations (Scopus)

Abstract

Two joining methods, transient-liquid-phase (TLP) joining and liquid-film-assisted joining (LFAJ), have been used to bond alumina ceramics. Both methods rely on multilayer metallic interlayers designed to form thin liquid films at reduced temperatures. The liquid films either disappear by interdiffusion (TLP) or promote ceramic/metal interface formation and concurrent dewetting of the liquid film (LFAJ). Progress on extending the TLP method to lower temperatures by combining low-melting-point (<450 °C) liquids and commercial reactive-metal brazes is described. Recent LFAJ work on joining alumina to niobium using copper films is presented.

Original languageEnglish
Pages (from-to)363-372
Number of pages10
JournalJournal of the European Ceramic Society
Volume26
Issue number4-5
DOIs
Publication statusPublished - Jan 11 2006

All Science Journal Classification (ASJC) codes

  • Ceramics and Composites
  • Materials Chemistry

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