Transient liquid phase bonding of HfC-based ceramics

Laura Esposito, Diletta Sciti, Laura Silvestroni, Cesare Melandri, Stefano Guicciardi, Noritaka Saito, Kunihiko Nakashima, Andreas M. Glaeser

Research output: Contribution to journalArticle

12 Citations (Scopus)

Abstract

Transient liquid phase (TLP) bonding enables joining at lower temperatures than traditional bonding techniques and preserves the potential for high-temperature applications, making it particularly attractive for joining ultra-high-temperature ceramics (UHTCs) such as carbides and borides. The feasibility of a TLP joint between "pure" carbides has been recently demonstrated. The present study examines the interactions that occur between undoped HfC or MoSi2-doped HfC and a Ni/Nb/Ni multilayer interlayer during TLP bonding. Bonding is performed at 1400 C for 30 min in a high-vacuum furnace. SEM-EDS characterization shows that the reaction layer formed at the interlayer/ceramic interface contains mixed carbides and depending upon the ceramic, Ni-Nb-Hf, or Ni-Nb-Hf-Si, or Ni-Nb-Si alloys. Nanoindentation tests traversing the reaction layer between the bulk ceramic and Nb foil midplane also show a clear transition zone across which the indentation modulus and hardness vary. Crack-free joints have been obtained with undoped HfC. The addition of 5 vol% MoSi2 introduces small (<5 μm long) isolated cracks within the reaction layer, whereas with 15 vol% MoSi2 added, cracking was pervasive within the reaction layer. When the reaction layer exceeds a critical thickness, as in the case of the bond obtained with HfC doped with 15 vol% MoSi2, residual stresses become sufficiently large to cause extensive cracking and bond failure. The results suggest a need to characterize and balance the positive role of additives on sintering with the potentially deleterious role they may have on joining.

Original languageEnglish
Pages (from-to)654-664
Number of pages11
JournalJournal of Materials Science
Volume49
Issue number2
DOIs
Publication statusPublished - Jan 1 2014

Fingerprint

Joining
Carbides
Liquids
Boron Compounds
Cracks
Vacuum furnaces
High temperature applications
Borides
Nanoindentation
Indentation
Metal foil
Energy dispersive spectroscopy
Residual stresses
Multilayers
Sintering
Hardness
Temperature
Scanning electron microscopy

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Esposito, L., Sciti, D., Silvestroni, L., Melandri, C., Guicciardi, S., Saito, N., ... Glaeser, A. M. (2014). Transient liquid phase bonding of HfC-based ceramics. Journal of Materials Science, 49(2), 654-664. https://doi.org/10.1007/s10853-013-7746-2

Transient liquid phase bonding of HfC-based ceramics. / Esposito, Laura; Sciti, Diletta; Silvestroni, Laura; Melandri, Cesare; Guicciardi, Stefano; Saito, Noritaka; Nakashima, Kunihiko; Glaeser, Andreas M.

In: Journal of Materials Science, Vol. 49, No. 2, 01.01.2014, p. 654-664.

Research output: Contribution to journalArticle

Esposito, L, Sciti, D, Silvestroni, L, Melandri, C, Guicciardi, S, Saito, N, Nakashima, K & Glaeser, AM 2014, 'Transient liquid phase bonding of HfC-based ceramics', Journal of Materials Science, vol. 49, no. 2, pp. 654-664. https://doi.org/10.1007/s10853-013-7746-2
Esposito L, Sciti D, Silvestroni L, Melandri C, Guicciardi S, Saito N et al. Transient liquid phase bonding of HfC-based ceramics. Journal of Materials Science. 2014 Jan 1;49(2):654-664. https://doi.org/10.1007/s10853-013-7746-2
Esposito, Laura ; Sciti, Diletta ; Silvestroni, Laura ; Melandri, Cesare ; Guicciardi, Stefano ; Saito, Noritaka ; Nakashima, Kunihiko ; Glaeser, Andreas M. / Transient liquid phase bonding of HfC-based ceramics. In: Journal of Materials Science. 2014 ; Vol. 49, No. 2. pp. 654-664.
@article{5c14ae5593f4473a87082b9596b305d2,
title = "Transient liquid phase bonding of HfC-based ceramics",
abstract = "Transient liquid phase (TLP) bonding enables joining at lower temperatures than traditional bonding techniques and preserves the potential for high-temperature applications, making it particularly attractive for joining ultra-high-temperature ceramics (UHTCs) such as carbides and borides. The feasibility of a TLP joint between {"}pure{"} carbides has been recently demonstrated. The present study examines the interactions that occur between undoped HfC or MoSi2-doped HfC and a Ni/Nb/Ni multilayer interlayer during TLP bonding. Bonding is performed at 1400 C for 30 min in a high-vacuum furnace. SEM-EDS characterization shows that the reaction layer formed at the interlayer/ceramic interface contains mixed carbides and depending upon the ceramic, Ni-Nb-Hf, or Ni-Nb-Hf-Si, or Ni-Nb-Si alloys. Nanoindentation tests traversing the reaction layer between the bulk ceramic and Nb foil midplane also show a clear transition zone across which the indentation modulus and hardness vary. Crack-free joints have been obtained with undoped HfC. The addition of 5 vol{\%} MoSi2 introduces small (<5 μm long) isolated cracks within the reaction layer, whereas with 15 vol{\%} MoSi2 added, cracking was pervasive within the reaction layer. When the reaction layer exceeds a critical thickness, as in the case of the bond obtained with HfC doped with 15 vol{\%} MoSi2, residual stresses become sufficiently large to cause extensive cracking and bond failure. The results suggest a need to characterize and balance the positive role of additives on sintering with the potentially deleterious role they may have on joining.",
author = "Laura Esposito and Diletta Sciti and Laura Silvestroni and Cesare Melandri and Stefano Guicciardi and Noritaka Saito and Kunihiko Nakashima and Glaeser, {Andreas M.}",
year = "2014",
month = "1",
day = "1",
doi = "10.1007/s10853-013-7746-2",
language = "English",
volume = "49",
pages = "654--664",
journal = "Journal of Materials Science",
issn = "0022-2461",
publisher = "Springer Netherlands",
number = "2",

}

TY - JOUR

T1 - Transient liquid phase bonding of HfC-based ceramics

AU - Esposito, Laura

AU - Sciti, Diletta

AU - Silvestroni, Laura

AU - Melandri, Cesare

AU - Guicciardi, Stefano

AU - Saito, Noritaka

AU - Nakashima, Kunihiko

AU - Glaeser, Andreas M.

PY - 2014/1/1

Y1 - 2014/1/1

N2 - Transient liquid phase (TLP) bonding enables joining at lower temperatures than traditional bonding techniques and preserves the potential for high-temperature applications, making it particularly attractive for joining ultra-high-temperature ceramics (UHTCs) such as carbides and borides. The feasibility of a TLP joint between "pure" carbides has been recently demonstrated. The present study examines the interactions that occur between undoped HfC or MoSi2-doped HfC and a Ni/Nb/Ni multilayer interlayer during TLP bonding. Bonding is performed at 1400 C for 30 min in a high-vacuum furnace. SEM-EDS characterization shows that the reaction layer formed at the interlayer/ceramic interface contains mixed carbides and depending upon the ceramic, Ni-Nb-Hf, or Ni-Nb-Hf-Si, or Ni-Nb-Si alloys. Nanoindentation tests traversing the reaction layer between the bulk ceramic and Nb foil midplane also show a clear transition zone across which the indentation modulus and hardness vary. Crack-free joints have been obtained with undoped HfC. The addition of 5 vol% MoSi2 introduces small (<5 μm long) isolated cracks within the reaction layer, whereas with 15 vol% MoSi2 added, cracking was pervasive within the reaction layer. When the reaction layer exceeds a critical thickness, as in the case of the bond obtained with HfC doped with 15 vol% MoSi2, residual stresses become sufficiently large to cause extensive cracking and bond failure. The results suggest a need to characterize and balance the positive role of additives on sintering with the potentially deleterious role they may have on joining.

AB - Transient liquid phase (TLP) bonding enables joining at lower temperatures than traditional bonding techniques and preserves the potential for high-temperature applications, making it particularly attractive for joining ultra-high-temperature ceramics (UHTCs) such as carbides and borides. The feasibility of a TLP joint between "pure" carbides has been recently demonstrated. The present study examines the interactions that occur between undoped HfC or MoSi2-doped HfC and a Ni/Nb/Ni multilayer interlayer during TLP bonding. Bonding is performed at 1400 C for 30 min in a high-vacuum furnace. SEM-EDS characterization shows that the reaction layer formed at the interlayer/ceramic interface contains mixed carbides and depending upon the ceramic, Ni-Nb-Hf, or Ni-Nb-Hf-Si, or Ni-Nb-Si alloys. Nanoindentation tests traversing the reaction layer between the bulk ceramic and Nb foil midplane also show a clear transition zone across which the indentation modulus and hardness vary. Crack-free joints have been obtained with undoped HfC. The addition of 5 vol% MoSi2 introduces small (<5 μm long) isolated cracks within the reaction layer, whereas with 15 vol% MoSi2 added, cracking was pervasive within the reaction layer. When the reaction layer exceeds a critical thickness, as in the case of the bond obtained with HfC doped with 15 vol% MoSi2, residual stresses become sufficiently large to cause extensive cracking and bond failure. The results suggest a need to characterize and balance the positive role of additives on sintering with the potentially deleterious role they may have on joining.

UR - http://www.scopus.com/inward/record.url?scp=84891375257&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84891375257&partnerID=8YFLogxK

U2 - 10.1007/s10853-013-7746-2

DO - 10.1007/s10853-013-7746-2

M3 - Article

AN - SCOPUS:84891375257

VL - 49

SP - 654

EP - 664

JO - Journal of Materials Science

JF - Journal of Materials Science

SN - 0022-2461

IS - 2

ER -