Transmission electron microscopy study on microstructure of Ag-Based conductive adhesives

Naoyuki Kawamoto, Yasukazu Murakami, Daisuke Shindo, Yuichiro Hayasaka, Takeshi Kan, Katsuaki Suganuma

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

We used advanced electron microscopy techniques to study the microstructure of Ag-based conductive adhesives, which are promising alternatives to Pb-free solders. Systematic microscopy observations revealed the development of connections between Ag agglomerates, when the weight density of Ag (Ag content) was increased up to 92mass%. However, in a sample containing 94mass% Ag, disconnection between well-defined Ag agglomerates and/or formation of voids between Ag-filler particles were observed. These results appeared to be consistent with the plot of resistivity versus Ag content: the resistivity decreased to a minimum value at 92 mass% Ag. We also demonstrated the formation of very small Ag particles in a thin-foil specimen subjected to electrical breakdown. This microscopic observation may be useful for understanding the process of electric breakdown in thin-foil specimens.

Original languageEnglish
Pages (from-to)1773-1778
Number of pages6
JournalMaterials Transactions
Volume51
Issue number10
DOIs
Publication statusPublished - Oct 1 2010

Fingerprint

adhesives
Metal foil
foils
Adhesives
Transmission electron microscopy
transmission electron microscopy
microstructure
Microstructure
electrical resistivity
solders
Electric breakdown
fillers
electrical faults
Electron microscopy
Fillers
voids
electron microscopy
Microscopic examination
breakdown
plots

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Transmission electron microscopy study on microstructure of Ag-Based conductive adhesives. / Kawamoto, Naoyuki; Murakami, Yasukazu; Shindo, Daisuke; Hayasaka, Yuichiro; Kan, Takeshi; Suganuma, Katsuaki.

In: Materials Transactions, Vol. 51, No. 10, 01.10.2010, p. 1773-1778.

Research output: Contribution to journalArticle

Kawamoto, Naoyuki ; Murakami, Yasukazu ; Shindo, Daisuke ; Hayasaka, Yuichiro ; Kan, Takeshi ; Suganuma, Katsuaki. / Transmission electron microscopy study on microstructure of Ag-Based conductive adhesives. In: Materials Transactions. 2010 ; Vol. 51, No. 10. pp. 1773-1778.
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