Trend in thermal resistance of advanced power modules

Nobuyuki Shishido, Masanori Tsukuda, Shin Ichi Nishizawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Thermal management is essential to reliable design of power modules. In this report, a trend in the thermal resistance of power modules was examined by reviewing the current cooling technologies. The thermal resistance of power modules has decreased to approximately 1/3x in 10 years. Our numerical simulation about cooling suggests that a straightforward development in liquid cooling technology can achieve the update corresponds to the expected change in next 5 year when it keeps this trend in next decades. However, further progress in thermal resistance shall require higher thermal-conductive materials for spreader and two-phase cooling technologies.

Original languageEnglish
Title of host publicationPCIM Europe-International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 2019
EditorsMartina Amrhein, Anna Schulze Niehoff
PublisherMesago PCIM GmbH
Pages104-108
Number of pages5
ISBN (Print)9783800749386
Publication statusPublished - 2019
EventInternational Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2019 - Nuremberg, Germany
Duration: May 7 2019May 9 2019

Publication series

NamePCIM Europe Conference Proceedings
ISSN (Electronic)2191-3358

Conference

ConferenceInternational Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2019
CountryGermany
CityNuremberg
Period5/7/195/9/19

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Trend in thermal resistance of advanced power modules'. Together they form a unique fingerprint.

Cite this