Trend of semiconductor devices and planarization technology with future development

Toshiro Doi, Hirokuni Hiyama, Akira Fukuda, Syuhei Kurokawa

Research output: Contribution to journalReview article

2 Citations (Scopus)
Original languageEnglish
Pages (from-to)745-750
Number of pages6
JournalSeimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Volume73
Issue number7
DOIs
Publication statusPublished - Dec 1 2007
Externally publishedYes

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Chemical mechanical polishing
Semiconductor devices

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering

Cite this

Trend of semiconductor devices and planarization technology with future development. / Doi, Toshiro; Hiyama, Hirokuni; Fukuda, Akira; Kurokawa, Syuhei.

In: Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering, Vol. 73, No. 7, 01.12.2007, p. 745-750.

Research output: Contribution to journalReview article

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