Trend of semiconductor devices and planarization technology with future development

Toshiro Doi; Hirokuni Hiyama; Akira Fukuda; Shuhei Kurokawa

doi:10.2493/jjspe.73.745

Trend of semiconductor devices and planarization technology with future development

Toshiro Doi, Hirokuni Hiyama, Akira Fukuda, Shuhei Kurokawa

Research output: Contribution to journal › Review article › peer-review

Original language	English
Pages (from-to)	745-750
Number of pages	6
Journal	Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Volume	73
Issue number	7
DOIs	https://doi.org/10.2493/jjspe.73.745
Publication status	Published - 2007
Externally published	Yes

All Science Journal Classification (ASJC) codes

Mechanical Engineering

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10.2493/jjspe.73.745

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title = "Trend of semiconductor devices and planarization technology with future development",

author = "Toshiro Doi and Hirokuni Hiyama and Akira Fukuda and Shuhei Kurokawa",

year = "2007",

doi = "10.2493/jjspe.73.745",

language = "English",

volume = "73",

pages = "745--750",

journal = "Journal of the Japan Society for Precision Engineering",

issn = "0912-0289",

publisher = "Japan Society for Precision Engineering",

number = "7",

}

TY - JOUR

T1 - Trend of semiconductor devices and planarization technology with future development

AU - Doi, Toshiro

AU - Hiyama, Hirokuni

AU - Fukuda, Akira

AU - Kurokawa, Shuhei

PY - 2007

Y1 - 2007

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DO - 10.2493/jjspe.73.745

M3 - Review article

AN - SCOPUS:77950229325

SN - 0912-0289

VL - 73

SP - 745

EP - 750

JO - Journal of the Japan Society for Precision Engineering

JF - Journal of the Japan Society for Precision Engineering

IS - 7

ER -

Trend of semiconductor devices and planarization technology with future development

All Science Journal Classification (ASJC) codes

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