Two-dimensional Moiré phase analysis for accurate strain distribution measurement and application in crack prediction

Qinghua Wang, Shien Ri, Hiroshi Tsuda, Motomichi Koyama, Kaneaki Tsuzaki

Research output: Contribution to journalArticle

12 Citations (Scopus)

Abstract

Aimed at the low accuracy problem of shear strain measurement in Moiré methods, a two-dimensional (2D) Moiré phase analysis method is proposed for full-field deformation measurement with high accuracy. A grid image is first processed by the spatial phase-shifting sampling Moiré technique to get the Moiré phases in two directions, which are then conjointly analyzed for measuring 2D displacement and strain distributions. The strain especially the shear strain measurement accuracy is remarkably improved, and dynamic deformation is measurable from automatic batch processing of single-shot grid images. As an application, the 2D microscale strain distributions of a titanium alloy were measured, and the crack occurrence location was successfully predicted from strain concentration.

Original languageEnglish
Pages (from-to)13465-13480
Number of pages16
JournalOptics Express
Volume25
Issue number12
DOIs
Publication statusPublished - Jun 12 2017

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strain distribution
cracks
strain measurement
shear strain
predictions
grids
batch processing
titanium alloys
microbalances
shot
sampling
occurrences

All Science Journal Classification (ASJC) codes

  • Atomic and Molecular Physics, and Optics

Cite this

Two-dimensional Moiré phase analysis for accurate strain distribution measurement and application in crack prediction. / Wang, Qinghua; Ri, Shien; Tsuda, Hiroshi; Koyama, Motomichi; Tsuzaki, Kaneaki.

In: Optics Express, Vol. 25, No. 12, 12.06.2017, p. 13465-13480.

Research output: Contribution to journalArticle

Wang, Qinghua ; Ri, Shien ; Tsuda, Hiroshi ; Koyama, Motomichi ; Tsuzaki, Kaneaki. / Two-dimensional Moiré phase analysis for accurate strain distribution measurement and application in crack prediction. In: Optics Express. 2017 ; Vol. 25, No. 12. pp. 13465-13480.
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