Ultracompact 60-GHz CMOS BPF Employing Broadside-Coupled Open-Loop Resonators

Anwer S.Abd El-Hameed; Adel Barakat; Adel B. Abdel-Rahman; Ahmed Allam; Ramesh K. Pokharel

doi:10.1109/LMWC.2017.2734771

Ultracompact 60-GHz CMOS BPF Employing Broadside-Coupled Open-Loop Resonators

Anwer S.Abd El-Hameed, Adel Barakat, Adel B. Abdel-Rahman, Ahmed Allam, Ramesh K. Pokharel

Department of I&E Visionaries

Research output: Contribution to journal › Article › peer-review

14 Citations (Scopus)

Abstract

This letter presents a 60-GHz ultracompact on-chip bandpass filter (BPF). The designed filter is based on a unique structure, which consists of two overlapped broadside-coupled open-loop resonators, achieving a high level of miniaturization. Moreover, each resonator is loaded by a metal-insulator-metal capacitor to get further miniaturization. Defected ground structure pattern is constructed under the filter structure to enhance the insertion loss (IL). This BPF is designed and fabricated using a standard 0.18- μ complementary metal-oxide-semiconductor technology for millimeter-wave applications. The fabricated BPF chip size is 240 × 225-μ 2 including pads. The measured results agree well with the simulation ones and show that the BPF has an IL of 3.3 dB at 59.5-GHz center frequency, and a bandwidth of 12.9 GHz.

Original language	English
Article number	8010799
Pages (from-to)	818-820
Number of pages	3
Journal	IEEE Microwave and Wireless Components Letters
Volume	27
Issue number	9
DOIs	https://doi.org/10.1109/LMWC.2017.2734771
Publication status	Published - Sep 2017

All Science Journal Classification (ASJC) codes

Condensed Matter Physics
Electrical and Electronic Engineering

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@article{854f034f1527445085dba75a366fbcbe,

title = "Ultracompact 60-GHz CMOS BPF Employing Broadside-Coupled Open-Loop Resonators",

abstract = "This letter presents a 60-GHz ultracompact on-chip bandpass filter (BPF). The designed filter is based on a unique structure, which consists of two overlapped broadside-coupled open-loop resonators, achieving a high level of miniaturization. Moreover, each resonator is loaded by a metal-insulator-metal capacitor to get further miniaturization. Defected ground structure pattern is constructed under the filter structure to enhance the insertion loss (IL). This BPF is designed and fabricated using a standard 0.18- μ complementary metal-oxide-semiconductor technology for millimeter-wave applications. The fabricated BPF chip size is 240 × 225-μ 2 including pads. The measured results agree well with the simulation ones and show that the BPF has an IL of 3.3 dB at 59.5-GHz center frequency, and a bandwidth of 12.9 GHz.",

author = "El-Hameed, {Anwer S.Abd} and Adel Barakat and Abdel-Rahman, {Adel B.} and Ahmed Allam and Pokharel, {Ramesh K.}",

year = "2017",

month = sep,

doi = "10.1109/LMWC.2017.2734771",

language = "English",

volume = "27",

pages = "818--820",

journal = "IEEE Microwave and Wireless Components Letters",

issn = "1531-1309",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "9",

}

TY - JOUR

T1 - Ultracompact 60-GHz CMOS BPF Employing Broadside-Coupled Open-Loop Resonators

AU - El-Hameed, Anwer S.Abd

AU - Barakat, Adel

AU - Abdel-Rahman, Adel B.

AU - Allam, Ahmed

AU - Pokharel, Ramesh K.

PY - 2017/9

Y1 - 2017/9

N2 - This letter presents a 60-GHz ultracompact on-chip bandpass filter (BPF). The designed filter is based on a unique structure, which consists of two overlapped broadside-coupled open-loop resonators, achieving a high level of miniaturization. Moreover, each resonator is loaded by a metal-insulator-metal capacitor to get further miniaturization. Defected ground structure pattern is constructed under the filter structure to enhance the insertion loss (IL). This BPF is designed and fabricated using a standard 0.18- μ complementary metal-oxide-semiconductor technology for millimeter-wave applications. The fabricated BPF chip size is 240 × 225-μ 2 including pads. The measured results agree well with the simulation ones and show that the BPF has an IL of 3.3 dB at 59.5-GHz center frequency, and a bandwidth of 12.9 GHz.

AB - This letter presents a 60-GHz ultracompact on-chip bandpass filter (BPF). The designed filter is based on a unique structure, which consists of two overlapped broadside-coupled open-loop resonators, achieving a high level of miniaturization. Moreover, each resonator is loaded by a metal-insulator-metal capacitor to get further miniaturization. Defected ground structure pattern is constructed under the filter structure to enhance the insertion loss (IL). This BPF is designed and fabricated using a standard 0.18- μ complementary metal-oxide-semiconductor technology for millimeter-wave applications. The fabricated BPF chip size is 240 × 225-μ 2 including pads. The measured results agree well with the simulation ones and show that the BPF has an IL of 3.3 dB at 59.5-GHz center frequency, and a bandwidth of 12.9 GHz.

UR - http://www.scopus.com/inward/record.url?scp=85028455308&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85028455308&partnerID=8YFLogxK

U2 - 10.1109/LMWC.2017.2734771

DO - 10.1109/LMWC.2017.2734771

M3 - Article

AN - SCOPUS:85028455308

VL - 27

SP - 818

EP - 820

JO - IEEE Microwave and Wireless Components Letters

JF - IEEE Microwave and Wireless Components Letters

SN - 1531-1309

IS - 9

M1 - 8010799

ER -