Abstract
This letter presents a 60-GHz ultracompact on-chip bandpass filter (BPF). The designed filter is based on a unique structure, which consists of two overlapped broadside-coupled open-loop resonators, achieving a high level of miniaturization. Moreover, each resonator is loaded by a metal-insulator-metal capacitor to get further miniaturization. Defected ground structure pattern is constructed under the filter structure to enhance the insertion loss (IL). This BPF is designed and fabricated using a standard 0.18- μ complementary metal-oxide-semiconductor technology for millimeter-wave applications. The fabricated BPF chip size is 240 × 225-μ 2 including pads. The measured results agree well with the simulation ones and show that the BPF has an IL of 3.3 dB at 59.5-GHz center frequency, and a bandwidth of 12.9 GHz.
| Original language | English |
|---|---|
| Article number | 8010799 |
| Pages (from-to) | 818-820 |
| Number of pages | 3 |
| Journal | IEEE Microwave and Wireless Components Letters |
| Volume | 27 |
| Issue number | 9 |
| DOIs | |
| Publication status | Published - Sep 2017 |
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All Science Journal Classification (ASJC) codes
- Condensed Matter Physics
- Electrical and Electronic Engineering
Cite this
Ultracompact 60-GHz CMOS BPF Employing Broadside-Coupled Open-Loop Resonators. / El-Hameed, Anwer S.Abd; Barakat, Adel; Abdel-Rahman, Adel B.; Allam, Ahmed; Pokharel, Ramesh K.
In: IEEE Microwave and Wireless Components Letters, Vol. 27, No. 9, 8010799, 09.2017, p. 818-820.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Ultracompact 60-GHz CMOS BPF Employing Broadside-Coupled Open-Loop Resonators
AU - El-Hameed, Anwer S.Abd
AU - Barakat, Adel
AU - Abdel-Rahman, Adel B.
AU - Allam, Ahmed
AU - Pokharel, Ramesh K.
PY - 2017/9
Y1 - 2017/9
N2 - This letter presents a 60-GHz ultracompact on-chip bandpass filter (BPF). The designed filter is based on a unique structure, which consists of two overlapped broadside-coupled open-loop resonators, achieving a high level of miniaturization. Moreover, each resonator is loaded by a metal-insulator-metal capacitor to get further miniaturization. Defected ground structure pattern is constructed under the filter structure to enhance the insertion loss (IL). This BPF is designed and fabricated using a standard 0.18- μ complementary metal-oxide-semiconductor technology for millimeter-wave applications. The fabricated BPF chip size is 240 × 225-μ 2 including pads. The measured results agree well with the simulation ones and show that the BPF has an IL of 3.3 dB at 59.5-GHz center frequency, and a bandwidth of 12.9 GHz.
AB - This letter presents a 60-GHz ultracompact on-chip bandpass filter (BPF). The designed filter is based on a unique structure, which consists of two overlapped broadside-coupled open-loop resonators, achieving a high level of miniaturization. Moreover, each resonator is loaded by a metal-insulator-metal capacitor to get further miniaturization. Defected ground structure pattern is constructed under the filter structure to enhance the insertion loss (IL). This BPF is designed and fabricated using a standard 0.18- μ complementary metal-oxide-semiconductor technology for millimeter-wave applications. The fabricated BPF chip size is 240 × 225-μ 2 including pads. The measured results agree well with the simulation ones and show that the BPF has an IL of 3.3 dB at 59.5-GHz center frequency, and a bandwidth of 12.9 GHz.
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U2 - 10.1109/LMWC.2017.2734771
DO - 10.1109/LMWC.2017.2734771
M3 - Article
AN - SCOPUS:85028455308
VL - 27
SP - 818
EP - 820
JO - IEEE Microwave and Wireless Components Letters
JF - IEEE Microwave and Wireless Components Letters
SN - 1531-1309
IS - 9
M1 - 8010799
ER -