Ultramicrotomy of wire-bonded interfaces for TEM observation

Yoshiko Itoh, Hiroshi Haji, Hideharu Nakashima, Haruo Kishida

Research output: Contribution to journalComment/debate

2 Citations (Scopus)

Abstract

To develop a technique for TEM examination of wire-bonded interfaces, which is important to solve problems in the IC industry, thin films with intermetallic interfaces were prepared by an ultramicrotome technique. There is no amorphous phase in these films, whereas in the films prepared by ion milling, the interface has become amorphous. From this result, a suitable TEM microscopic technique to prepare films of wire-bonded interface is discussed.

Original languageEnglish
Pages (from-to)151-153
Number of pages3
JournalJournal of Electron Microscopy
Volume44
Issue number3
Publication statusPublished - Jun 1 1995

Fingerprint

Microtomy
Industry
Observation
wire
Wire
Ions
Transmission electron microscopy
transmission electron microscopy
Intermetallics
intermetallics
examination
industries
Thin films
thin films
ions

All Science Journal Classification (ASJC) codes

  • Instrumentation

Cite this

Ultramicrotomy of wire-bonded interfaces for TEM observation. / Itoh, Yoshiko; Haji, Hiroshi; Nakashima, Hideharu; Kishida, Haruo.

In: Journal of Electron Microscopy, Vol. 44, No. 3, 01.06.1995, p. 151-153.

Research output: Contribution to journalComment/debate

Itoh, Y, Haji, H, Nakashima, H & Kishida, H 1995, 'Ultramicrotomy of wire-bonded interfaces for TEM observation', Journal of Electron Microscopy, vol. 44, no. 3, pp. 151-153.
Itoh, Yoshiko ; Haji, Hiroshi ; Nakashima, Hideharu ; Kishida, Haruo. / Ultramicrotomy of wire-bonded interfaces for TEM observation. In: Journal of Electron Microscopy. 1995 ; Vol. 44, No. 3. pp. 151-153.
@article{0fb5a9d31826468590083568dfc9f907,
title = "Ultramicrotomy of wire-bonded interfaces for TEM observation",
abstract = "To develop a technique for TEM examination of wire-bonded interfaces, which is important to solve problems in the IC industry, thin films with intermetallic interfaces were prepared by an ultramicrotome technique. There is no amorphous phase in these films, whereas in the films prepared by ion milling, the interface has become amorphous. From this result, a suitable TEM microscopic technique to prepare films of wire-bonded interface is discussed.",
author = "Yoshiko Itoh and Hiroshi Haji and Hideharu Nakashima and Haruo Kishida",
year = "1995",
month = "6",
day = "1",
language = "English",
volume = "44",
pages = "151--153",
journal = "Microscopy (Oxford, England)",
issn = "2050-5698",
publisher = "Japanese Society of Microscopy",
number = "3",

}

TY - JOUR

T1 - Ultramicrotomy of wire-bonded interfaces for TEM observation

AU - Itoh, Yoshiko

AU - Haji, Hiroshi

AU - Nakashima, Hideharu

AU - Kishida, Haruo

PY - 1995/6/1

Y1 - 1995/6/1

N2 - To develop a technique for TEM examination of wire-bonded interfaces, which is important to solve problems in the IC industry, thin films with intermetallic interfaces were prepared by an ultramicrotome technique. There is no amorphous phase in these films, whereas in the films prepared by ion milling, the interface has become amorphous. From this result, a suitable TEM microscopic technique to prepare films of wire-bonded interface is discussed.

AB - To develop a technique for TEM examination of wire-bonded interfaces, which is important to solve problems in the IC industry, thin films with intermetallic interfaces were prepared by an ultramicrotome technique. There is no amorphous phase in these films, whereas in the films prepared by ion milling, the interface has become amorphous. From this result, a suitable TEM microscopic technique to prepare films of wire-bonded interface is discussed.

UR - http://www.scopus.com/inward/record.url?scp=0039196335&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0039196335&partnerID=8YFLogxK

M3 - Comment/debate

AN - SCOPUS:0039196335

VL - 44

SP - 151

EP - 153

JO - Microscopy (Oxford, England)

JF - Microscopy (Oxford, England)

SN - 2050-5698

IS - 3

ER -