Ultramicrotomy of wire-bonded interfaces for TEM observation

Yoshiko Itoh, Hiroshi Haji, Hideharu Nakashima, Haruo Kishida

Research output: Contribution to journalComment/debatepeer-review

2 Citations (Scopus)

Abstract

To develop a technique for TEM examination of wire-bonded interfaces, which is important to solve problems in the IC industry, thin films with intermetallic interfaces were prepared by an ultramicrotome technique. There is no amorphous phase in these films, whereas in the films prepared by ion milling, the interface has become amorphous. From this result, a suitable TEM microscopic technique to prepare films of wire-bonded interface is discussed.

Original languageEnglish
Pages (from-to)151-153
Number of pages3
JournalJournal of Electron Microscopy
Volume44
Issue number3
Publication statusPublished - Jun 1995

All Science Journal Classification (ASJC) codes

  • Instrumentation

Fingerprint Dive into the research topics of 'Ultramicrotomy of wire-bonded interfaces for TEM observation'. Together they form a unique fingerprint.

Cite this