Ultrasonic bonding of cone bump for integration of large-scale integrated circuits in flexible electronics

Takanori Shuto, Keiichiro Iwanabe, Kazuhiro Noda, Seiya Nakai, Tanemasa Asano

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Ultrasonic bonding of cone bump for integration of large-scale integrated circuits in flexible electronics'. Together they form a unique fingerprint.

Physics & Astronomy

Engineering & Materials Science