Abstract
To clarify the solidification mechanism of thin alloy films between solid plates, the effects of the film thickness and the growth conditions on the unidirectional solidification structures of Al-Cu alloys were studied. The primary arm spacings of the thin film specimens, whose thicknesses were less than or equal to the secondary arm spacings, were twice or three times larger than those of bulk Al-15%Cu specimens. This phenomena were interpreted through the quantitative estimation of the influence of solid plates on the solute diffusion process in the liquid near dendrite tips. Two diffusion models were proposed, and the calculated ratios (Dh/D1) of the primary arm spacing Dh of the film and D1 of the bulk specimen were: (1) Columnar diffusion layer model: (Dh/D1) = {(4π/3)/ (2h/D1)}1/2, (2) Hemispherical diffusion layer model: (Dh/D1) = {(1/(2h/D1)}1/3. The intermediate value of the above models showed good agreement with the experimental ratios (dh/d1) of the film dh and the bulk d1.
| Original language | English |
|---|---|
| Pages (from-to) | 863-869 |
| Number of pages | 7 |
| Journal | Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals |
| Volume | 60 |
| Issue number | 9 |
| DOIs | |
| Publication status | Published - Jan 1 1996 |
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All Science Journal Classification (ASJC) codes
- Condensed Matter Physics
- Mechanics of Materials
- Metals and Alloys
- Materials Chemistry
Cite this
Unidirectional solidification of Al-Cu alloy films between solid plates. / Mori, Nobuyuki; Kitaoka, Takeshi; Miyahara, Hirofumi; Ogi, Keisaku.
In: Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals, Vol. 60, No. 9, 01.01.1996, p. 863-869.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Unidirectional solidification of Al-Cu alloy films between solid plates
AU - Mori, Nobuyuki
AU - Kitaoka, Takeshi
AU - Miyahara, Hirofumi
AU - Ogi, Keisaku
PY - 1996/1/1
Y1 - 1996/1/1
N2 - To clarify the solidification mechanism of thin alloy films between solid plates, the effects of the film thickness and the growth conditions on the unidirectional solidification structures of Al-Cu alloys were studied. The primary arm spacings of the thin film specimens, whose thicknesses were less than or equal to the secondary arm spacings, were twice or three times larger than those of bulk Al-15%Cu specimens. This phenomena were interpreted through the quantitative estimation of the influence of solid plates on the solute diffusion process in the liquid near dendrite tips. Two diffusion models were proposed, and the calculated ratios (Dh/D1) of the primary arm spacing Dh of the film and D1 of the bulk specimen were: (1) Columnar diffusion layer model: (Dh/D1) = {(4π/3)/ (2h/D1)}1/2, (2) Hemispherical diffusion layer model: (Dh/D1) = {(1/(2h/D1)}1/3. The intermediate value of the above models showed good agreement with the experimental ratios (dh/d1) of the film dh and the bulk d1.
AB - To clarify the solidification mechanism of thin alloy films between solid plates, the effects of the film thickness and the growth conditions on the unidirectional solidification structures of Al-Cu alloys were studied. The primary arm spacings of the thin film specimens, whose thicknesses were less than or equal to the secondary arm spacings, were twice or three times larger than those of bulk Al-15%Cu specimens. This phenomena were interpreted through the quantitative estimation of the influence of solid plates on the solute diffusion process in the liquid near dendrite tips. Two diffusion models were proposed, and the calculated ratios (Dh/D1) of the primary arm spacing Dh of the film and D1 of the bulk specimen were: (1) Columnar diffusion layer model: (Dh/D1) = {(4π/3)/ (2h/D1)}1/2, (2) Hemispherical diffusion layer model: (Dh/D1) = {(1/(2h/D1)}1/3. The intermediate value of the above models showed good agreement with the experimental ratios (dh/d1) of the film dh and the bulk d1.
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UR - http://www.scopus.com/inward/citedby.url?scp=0030232689&partnerID=8YFLogxK
U2 - 10.2320/jinstmet1952.60.9_863
DO - 10.2320/jinstmet1952.60.9_863
M3 - Article
AN - SCOPUS:0030232689
VL - 60
SP - 863
EP - 869
JO - Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
JF - Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
SN - 0021-4876
IS - 9
ER -