Unidirectional solidification of Al-Cu alloy films between solid plates

Nobuyuki Mori, Takeshi Kitaoka, Hirofumi Miyahara, Keisaku Ogi

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

To clarify the solidification mechanism of thin alloy films between solid plates, the effects of the film thickness and the growth conditions on the unidirectional solidification structures of Al-Cu alloys were studied. The primary arm spacings of the thin film specimens, whose thicknesses were less than or equal to the secondary arm spacings, were twice or three times larger than those of bulk Al-15%Cu specimens. This phenomena were interpreted through the quantitative estimation of the influence of solid plates on the solute diffusion process in the liquid near dendrite tips. Two diffusion models were proposed, and the calculated ratios (Dh/D1) of the primary arm spacing Dh of the film and D1 of the bulk specimen were: (1) Columnar diffusion layer model: (Dh/D1) = {(4π/3)/ (2h/D1)}1/2, (2) Hemispherical diffusion layer model: (Dh/D1) = {(1/(2h/D1)}1/3. The intermediate value of the above models showed good agreement with the experimental ratios (dh/d1) of the film dh and the bulk d1.

Original languageEnglish
Pages (from-to)863-869
Number of pages7
JournalNippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Volume60
Issue number9
DOIs
Publication statusPublished - Jan 1 1996

Fingerprint

solidification
Solidification
spacing
dendrites
Film thickness
solutes
film thickness
Thin films
Liquids
liquids
thin films

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Mechanics of Materials
  • Metals and Alloys
  • Materials Chemistry

Cite this

Unidirectional solidification of Al-Cu alloy films between solid plates. / Mori, Nobuyuki; Kitaoka, Takeshi; Miyahara, Hirofumi; Ogi, Keisaku.

In: Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals, Vol. 60, No. 9, 01.01.1996, p. 863-869.

Research output: Contribution to journalArticle

@article{61d6e92fe45e45d680f2061df20eb2c7,
title = "Unidirectional solidification of Al-Cu alloy films between solid plates",
abstract = "To clarify the solidification mechanism of thin alloy films between solid plates, the effects of the film thickness and the growth conditions on the unidirectional solidification structures of Al-Cu alloys were studied. The primary arm spacings of the thin film specimens, whose thicknesses were less than or equal to the secondary arm spacings, were twice or three times larger than those of bulk Al-15{\%}Cu specimens. This phenomena were interpreted through the quantitative estimation of the influence of solid plates on the solute diffusion process in the liquid near dendrite tips. Two diffusion models were proposed, and the calculated ratios (Dh/D1) of the primary arm spacing Dh of the film and D1 of the bulk specimen were: (1) Columnar diffusion layer model: (Dh/D1) = {(4π/3)/ (2h/D1)}1/2, (2) Hemispherical diffusion layer model: (Dh/D1) = {(1/(2h/D1)}1/3. The intermediate value of the above models showed good agreement with the experimental ratios (dh/d1) of the film dh and the bulk d1.",
author = "Nobuyuki Mori and Takeshi Kitaoka and Hirofumi Miyahara and Keisaku Ogi",
year = "1996",
month = "1",
day = "1",
doi = "10.2320/jinstmet1952.60.9_863",
language = "English",
volume = "60",
pages = "863--869",
journal = "Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals",
issn = "0021-4876",
publisher = "公益社団法人 日本金属学会",
number = "9",

}

TY - JOUR

T1 - Unidirectional solidification of Al-Cu alloy films between solid plates

AU - Mori, Nobuyuki

AU - Kitaoka, Takeshi

AU - Miyahara, Hirofumi

AU - Ogi, Keisaku

PY - 1996/1/1

Y1 - 1996/1/1

N2 - To clarify the solidification mechanism of thin alloy films between solid plates, the effects of the film thickness and the growth conditions on the unidirectional solidification structures of Al-Cu alloys were studied. The primary arm spacings of the thin film specimens, whose thicknesses were less than or equal to the secondary arm spacings, were twice or three times larger than those of bulk Al-15%Cu specimens. This phenomena were interpreted through the quantitative estimation of the influence of solid plates on the solute diffusion process in the liquid near dendrite tips. Two diffusion models were proposed, and the calculated ratios (Dh/D1) of the primary arm spacing Dh of the film and D1 of the bulk specimen were: (1) Columnar diffusion layer model: (Dh/D1) = {(4π/3)/ (2h/D1)}1/2, (2) Hemispherical diffusion layer model: (Dh/D1) = {(1/(2h/D1)}1/3. The intermediate value of the above models showed good agreement with the experimental ratios (dh/d1) of the film dh and the bulk d1.

AB - To clarify the solidification mechanism of thin alloy films between solid plates, the effects of the film thickness and the growth conditions on the unidirectional solidification structures of Al-Cu alloys were studied. The primary arm spacings of the thin film specimens, whose thicknesses were less than or equal to the secondary arm spacings, were twice or three times larger than those of bulk Al-15%Cu specimens. This phenomena were interpreted through the quantitative estimation of the influence of solid plates on the solute diffusion process in the liquid near dendrite tips. Two diffusion models were proposed, and the calculated ratios (Dh/D1) of the primary arm spacing Dh of the film and D1 of the bulk specimen were: (1) Columnar diffusion layer model: (Dh/D1) = {(4π/3)/ (2h/D1)}1/2, (2) Hemispherical diffusion layer model: (Dh/D1) = {(1/(2h/D1)}1/3. The intermediate value of the above models showed good agreement with the experimental ratios (dh/d1) of the film dh and the bulk d1.

UR - http://www.scopus.com/inward/record.url?scp=0030232689&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0030232689&partnerID=8YFLogxK

U2 - 10.2320/jinstmet1952.60.9_863

DO - 10.2320/jinstmet1952.60.9_863

M3 - Article

AN - SCOPUS:0030232689

VL - 60

SP - 863

EP - 869

JO - Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals

JF - Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals

SN - 0021-4876

IS - 9

ER -