Abstract
Formal methods have been used in the development of the reliable software system. However, one of the issues in using formal methods is how to model the system by considering what kind of system requirements and restrictions we should describe. In order to address this issue, we use a hazard model STAMP and an analytical method STPA based on STAMP. STAMP/STPA is proposed to overcome difficulties in approving conventional hazard analysis techniques for software-centric systems. In this report, we explain our approach and discuss our case study to develop implicit specifications for the cloud service in a model-oriented formal specification language, VDM++.
| Original language | English |
|---|---|
| Title of host publication | Proceedings - 2015 International Conference on Platform Technology and Service, PlatCon 2015 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 23-24 |
| Number of pages | 2 |
| ISBN (Electronic) | 9781479918881 |
| DOIs | |
| Publication status | Published - Apr 3 2015 |
| Event | 2015 2nd International Conference on Platform Technology and Service, PlatCon 2015 - Jeju, Korea, Republic of Duration: Jan 26 2015 → Jan 28 2015 |
Publication series
| Name | Proceedings - 2015 International Conference on Platform Technology and Service, PlatCon 2015 |
|---|
Other
| Other | 2015 2nd International Conference on Platform Technology and Service, PlatCon 2015 |
|---|---|
| Country | Korea, Republic of |
| City | Jeju |
| Period | 1/26/15 → 1/28/15 |
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All Science Journal Classification (ASJC) codes
- Computer Networks and Communications
- Human-Computer Interaction
- Information Systems
- Software
Cite this
Using hazard analysis STAMP/STPA in developing model-oriented formal specification toward reliable cloud service. / Hata, Akihiro; Araki, Keijiro; Kusakabe, Shigeru; Omori, Yoichi; Lin, Hsin Hung.
Proceedings - 2015 International Conference on Platform Technology and Service, PlatCon 2015. Institute of Electrical and Electronics Engineers Inc., 2015. p. 23-24 7079623 (Proceedings - 2015 International Conference on Platform Technology and Service, PlatCon 2015).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Using hazard analysis STAMP/STPA in developing model-oriented formal specification toward reliable cloud service
AU - Hata, Akihiro
AU - Araki, Keijiro
AU - Kusakabe, Shigeru
AU - Omori, Yoichi
AU - Lin, Hsin Hung
PY - 2015/4/3
Y1 - 2015/4/3
N2 - Formal methods have been used in the development of the reliable software system. However, one of the issues in using formal methods is how to model the system by considering what kind of system requirements and restrictions we should describe. In order to address this issue, we use a hazard model STAMP and an analytical method STPA based on STAMP. STAMP/STPA is proposed to overcome difficulties in approving conventional hazard analysis techniques for software-centric systems. In this report, we explain our approach and discuss our case study to develop implicit specifications for the cloud service in a model-oriented formal specification language, VDM++.
AB - Formal methods have been used in the development of the reliable software system. However, one of the issues in using formal methods is how to model the system by considering what kind of system requirements and restrictions we should describe. In order to address this issue, we use a hazard model STAMP and an analytical method STPA based on STAMP. STAMP/STPA is proposed to overcome difficulties in approving conventional hazard analysis techniques for software-centric systems. In this report, we explain our approach and discuss our case study to develop implicit specifications for the cloud service in a model-oriented formal specification language, VDM++.
UR - http://www.scopus.com/inward/record.url?scp=84928180087&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84928180087&partnerID=8YFLogxK
U2 - 10.1109/PlatCon.2015.14
DO - 10.1109/PlatCon.2015.14
M3 - Conference contribution
AN - SCOPUS:84928180087
T3 - Proceedings - 2015 International Conference on Platform Technology and Service, PlatCon 2015
SP - 23
EP - 24
BT - Proceedings - 2015 International Conference on Platform Technology and Service, PlatCon 2015
PB - Institute of Electrical and Electronics Engineers Inc.
ER -