Using NASA standard breakup model to describe low-velocity impacts on spacecraft

Toshiya Hanada, Tetsuo Yasaka, Iidehiro Hata, Vasuhiro Akahoshi

Research output: Contribution to journalArticle

6 Citations (Scopus)

Abstract

The applicability is examined of the hypervelocity collision model included in the NASA standard breakup model 2000 revision to low-velocity collisions possible in space, especially in the geosynchronous regime. The analytic method used in the standard breakup model is applied to experimental data from low-velocity impact experiments previously performed at Kyushu University at a velocity range less than 300 m/s. The projectiles and target specimens used were stainless steel balls and aluminum honeycomb sandwich panels with face sheets of carbon fiber reinforced plastic, respectively. It is concluded that the hypervelocity collision model in the standard breakup model can be applied to low-velocity collisions with some simple modifications.

Original languageEnglish
Pages (from-to)859-864
Number of pages6
JournalJournal of Spacecraft and Rockets
Volume42
Issue number5
DOIs
Publication statusPublished - Jan 1 2005

Fingerprint

spacecraft breakup
low speed
NASA
Spacecraft
spacecraft
collision
hypervelocity
collisions
carbon fiber reinforced plastics
Carbon fiber reinforced plastics
Projectiles
balls
projectiles
stainless steels
Stainless steel
aluminum
plastic
steel
Aluminum
experiment

All Science Journal Classification (ASJC) codes

  • Aerospace Engineering
  • Space and Planetary Science

Cite this

Using NASA standard breakup model to describe low-velocity impacts on spacecraft. / Hanada, Toshiya; Yasaka, Tetsuo; Hata, Iidehiro; Akahoshi, Vasuhiro.

In: Journal of Spacecraft and Rockets, Vol. 42, No. 5, 01.01.2005, p. 859-864.

Research output: Contribution to journalArticle

Hanada, Toshiya ; Yasaka, Tetsuo ; Hata, Iidehiro ; Akahoshi, Vasuhiro. / Using NASA standard breakup model to describe low-velocity impacts on spacecraft. In: Journal of Spacecraft and Rockets. 2005 ; Vol. 42, No. 5. pp. 859-864.
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