Verification of generation and removal process of surface brittle film, in polishing process using water soluble fullerenol

Kazumasa Kano, Terutake Hayashi, Yasuhiro Takaya, Ken Kokubo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Semiconductor devices have multilayer interconnection to achieve high density circuit. In the fabrication process, due to necessity of the flatness and the smoothness of each layer, CMP is widely used. However in the conventional copper-CMP process, the abrasive grain for the slurry has a problem to apply to the next design rule, due to their large particle sizes. Thus, water soluble fullerenol, C60(OH)36 whose particle size is quite small (<1 nm), and has high quality planarization efficiency, is proposed as the abrasive grain for copper-CMP. In this study, to determine the mechanism of the copper-CMP process using water soluble fullerenol, the generation of oxidized film is investigated, and on the surface of wafer, generation of a large amount of porous film is confirmed. Furthermore, in the case with and without C60(OH)36, the different materials appeared on the film. Therefore, it is considered that C60(OH) 36 has chemical effect that alters surface condition in this process.

Original languageEnglish
Title of host publication10th International Symposium on Measurement and Quality Control 2010, ISMQC 2010
Pages555-558
Number of pages4
Publication statusPublished - 2010
Externally publishedYes
Event10th International Symposium on Measurement and Quality Control 2010, ISMQC 2010 - Osaka, Japan
Duration: Sep 5 2010Sep 9 2010

Other

Other10th International Symposium on Measurement and Quality Control 2010, ISMQC 2010
CountryJapan
CityOsaka
Period9/5/109/9/10

Fingerprint

Polishing
Copper
Abrasives
Particle size
Water
Semiconductor devices
Multilayers
Fabrication
Networks (circuits)

All Science Journal Classification (ASJC) codes

  • Safety, Risk, Reliability and Quality

Cite this

Kano, K., Hayashi, T., Takaya, Y., & Kokubo, K. (2010). Verification of generation and removal process of surface brittle film, in polishing process using water soluble fullerenol. In 10th International Symposium on Measurement and Quality Control 2010, ISMQC 2010 (pp. 555-558)

Verification of generation and removal process of surface brittle film, in polishing process using water soluble fullerenol. / Kano, Kazumasa; Hayashi, Terutake; Takaya, Yasuhiro; Kokubo, Ken.

10th International Symposium on Measurement and Quality Control 2010, ISMQC 2010. 2010. p. 555-558.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kano, K, Hayashi, T, Takaya, Y & Kokubo, K 2010, Verification of generation and removal process of surface brittle film, in polishing process using water soluble fullerenol. in 10th International Symposium on Measurement and Quality Control 2010, ISMQC 2010. pp. 555-558, 10th International Symposium on Measurement and Quality Control 2010, ISMQC 2010, Osaka, Japan, 9/5/10.
Kano K, Hayashi T, Takaya Y, Kokubo K. Verification of generation and removal process of surface brittle film, in polishing process using water soluble fullerenol. In 10th International Symposium on Measurement and Quality Control 2010, ISMQC 2010. 2010. p. 555-558
Kano, Kazumasa ; Hayashi, Terutake ; Takaya, Yasuhiro ; Kokubo, Ken. / Verification of generation and removal process of surface brittle film, in polishing process using water soluble fullerenol. 10th International Symposium on Measurement and Quality Control 2010, ISMQC 2010. 2010. pp. 555-558
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