Vibration fatigue reliability of BGA-IC package with Pb-free solder and Pb-Sn solder

Young Bae Kim, Hiroshi Noguchi, Masazumi Amagai

Research output: Contribution to journalConference article

25 Citations (Scopus)

Abstract

The high cycle vibration fatigue life characteristics of Pb-free and Pb packages were studied under various mixed mode stress by a new test method and FEM. It was found that the effect of frequency on a high cycles vibration fatigue life of Pb-free and Pb package can be ignored within a range of 10∼25Hz. Using a normal shear stress, the evaluation of Pb-free and Pb package fatigue life was possible without considering a mixed mode stress. The vibration fatigue induced a crack in a solder ball itself.

Original languageEnglish
Pages (from-to)891-897
Number of pages7
JournalProceedings - Electronic Components and Technology Conference
Publication statusPublished - Jul 17 2003
Event53rd Electronic Components and Technology Conference 2003 - New Orleans LA, United States
Duration: May 27 2003May 30 2003

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All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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