Vibration fatigue reliability of BGA-IC package with Pb-free solder and Pb-Sn solder

Young Bae Kim, Hiroshi Noguchi, Masazumi Amagai

Research output: Contribution to journalConference article

25 Citations (Scopus)

Abstract

The high cycle vibration fatigue life characteristics of Pb-free and Pb packages were studied under various mixed mode stress by a new test method and FEM. It was found that the effect of frequency on a high cycles vibration fatigue life of Pb-free and Pb package can be ignored within a range of 10∼25Hz. Using a normal shear stress, the evaluation of Pb-free and Pb package fatigue life was possible without considering a mixed mode stress. The vibration fatigue induced a crack in a solder ball itself.

Original languageEnglish
Pages (from-to)891-897
Number of pages7
JournalProceedings - Electronic Components and Technology Conference
Publication statusPublished - Jul 17 2003
Event53rd Electronic Components and Technology Conference 2003 - New Orleans LA, United States
Duration: May 27 2003May 30 2003

Fingerprint

Soldering alloys
Fatigue of materials
Shear stress
Cracks
Finite element method
Lead-free solders

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Vibration fatigue reliability of BGA-IC package with Pb-free solder and Pb-Sn solder. / Kim, Young Bae; Noguchi, Hiroshi; Amagai, Masazumi.

In: Proceedings - Electronic Components and Technology Conference, 17.07.2003, p. 891-897.

Research output: Contribution to journalConference article

@article{9602369d1daa4c5bbc644889a2f96508,
title = "Vibration fatigue reliability of BGA-IC package with Pb-free solder and Pb-Sn solder",
abstract = "The high cycle vibration fatigue life characteristics of Pb-free and Pb packages were studied under various mixed mode stress by a new test method and FEM. It was found that the effect of frequency on a high cycles vibration fatigue life of Pb-free and Pb package can be ignored within a range of 10∼25Hz. Using a normal shear stress, the evaluation of Pb-free and Pb package fatigue life was possible without considering a mixed mode stress. The vibration fatigue induced a crack in a solder ball itself.",
author = "Kim, {Young Bae} and Hiroshi Noguchi and Masazumi Amagai",
year = "2003",
month = "7",
day = "17",
language = "English",
pages = "891--897",
journal = "Proceedings - Electronic Components and Technology Conference",
issn = "0569-5503",
publisher = "Institute of Electrical and Electronics Engineers Inc.",

}

TY - JOUR

T1 - Vibration fatigue reliability of BGA-IC package with Pb-free solder and Pb-Sn solder

AU - Kim, Young Bae

AU - Noguchi, Hiroshi

AU - Amagai, Masazumi

PY - 2003/7/17

Y1 - 2003/7/17

N2 - The high cycle vibration fatigue life characteristics of Pb-free and Pb packages were studied under various mixed mode stress by a new test method and FEM. It was found that the effect of frequency on a high cycles vibration fatigue life of Pb-free and Pb package can be ignored within a range of 10∼25Hz. Using a normal shear stress, the evaluation of Pb-free and Pb package fatigue life was possible without considering a mixed mode stress. The vibration fatigue induced a crack in a solder ball itself.

AB - The high cycle vibration fatigue life characteristics of Pb-free and Pb packages were studied under various mixed mode stress by a new test method and FEM. It was found that the effect of frequency on a high cycles vibration fatigue life of Pb-free and Pb package can be ignored within a range of 10∼25Hz. Using a normal shear stress, the evaluation of Pb-free and Pb package fatigue life was possible without considering a mixed mode stress. The vibration fatigue induced a crack in a solder ball itself.

UR - http://www.scopus.com/inward/record.url?scp=0038688986&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0038688986&partnerID=8YFLogxK

M3 - Conference article

SP - 891

EP - 897

JO - Proceedings - Electronic Components and Technology Conference

JF - Proceedings - Electronic Components and Technology Conference

SN - 0569-5503

ER -