The effect of additions on the wetting characteristics of liquid Cu on a Si3N4 substrate has been studied in parallel with the study of joining of Si3N4 using Cu/80Ni·20Cr/Cu interlayers. The addition of 80Ni·20Cr alloy and Cr reduced the contact angle of liquid Cu on a Si3N4 substrate. The contact angle reduction depended upon the Cr content of the sessile drop and anneal time. A multiphase reaction layer developed at the interface between the Cu-rich solidified droplet and Si3N4 when Cr or 80Ni·20Cr was added. The failure of Cu/80Ni·20Cr/Cu interlay er bonded Si3N4 occurred along the Si3N4/interlayer interface. At near the Si3N4/interlayer interface, a multiphase reaction layer has also developed. The strengths of bonded Si3N4 are strongly affected by the interfacial reaction products.
|Number of pages||6|
|Journal||Key Engineering Materials|
|Publication status||Published - Dec 1 1999|
All Science Journal Classification (ASJC) codes
- Materials Science(all)
- Mechanics of Materials
- Mechanical Engineering