Wettability of Al2O3 by liquid Cu as influenced by additives and partial transient liquid-phase bonding of Al2O3

H. Matsumoto, M. R. Locatelli, K. Nakashima, A. M. Glaeser, K. Mori

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12 Citations (Scopus)

Abstract

The effect of additions (Cr, Ni and 80Ni·20Cr alloy) on the wetting characteristics of liquid Cu on Al2O3 has been studied using a sessile drop method in a vacuum at 1150°C. Through the use of microdesigned multilayer Cu/80Ni·20Cr/Cu interlayers, PTLP (Partial Transient Liquid-Phase) bonding of Al2O3 has been achieved in a vacuum at 1150°C. These results demonstrate that the bonding temperature, the dissolution of Cr into liquid Cu film improved the wettability of liquid Cu film on Al2O3 and facilitate the formation of reliably strong joint PTLP bonded Al2O3 using Cu/80Ni·20Cr/Cu interlayer.

Original languageEnglish
Pages (from-to)555-564
Number of pages10
JournalMaterials Transactions, JIM
Volume36
Issue number4
DOIs
Publication statusPublished - 1995

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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