研究成果 1989 2020

フィルター
評論記事
2018
Semiconductor materials
Data storage equipment
2012
Bearing pads
Chemical mechanical polishing
Semiconductor materials
Industry
2007
2 引用 (Scopus)

Trend of semiconductor devices and planarization technology with future development

Doi, T., Hiyama, H., Fukuda, A. & Kurokawa, S., 12 1 2007, : : Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering. 73, 7, p. 745-750 6 p.

研究成果: ジャーナルへの寄稿評論記事

Chemical mechanical polishing
Semiconductor devices