Sawada, R.,
Nogami, H.,
Inoue, R. &
Higurashi, E.,
6月 22 2018,
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2018. Marcelli, R., Mita, Y., Smith, S., Pressecq, F., Nouet, P., Mailly, F. & Schneider, P. (eds.).
Institute of Electrical and Electronics Engineers Inc.,
p. 1-4 4 p. (Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2018).
研究成果: 書籍/レポート タイプへの寄稿 › 会議への寄与