Pureに変更を加えた場合、すぐここに表示されます。

Fingerprint Shin Nishimuraが取り組む研究トピックをご確認ください。これらのトピックラベルは、この人物の研究に基づいています。これらを共に使用することで、固有の認識が可能になります。

Engineering & Materials Science

Hydrogen
Rubber
O rings
Butadiene
Gases
Polymers
Electrolytes
Lithium
Composite materials
Copolymers
Ionic conductivity
Cracks
Ethylene
Ions
Monomers
Anionic polymerization
Carbon black
Propylene
Fillers
Temperature
Copolymerization
Crack initiation
Nuclear magnetic resonance
Polymerization
Silica
Ferroelectric materials
Conformations
Crack propagation
Phase transitions
Free volume
Swelling
Thermal expansion
Tensile stress
Activation energy
Thermodynamic properties
Seals
Peptides
Styrene
Amino acids
Carbonates
Superconducting transition temperature
Crystalline materials
Peroxides
Molecular weight
Infrared absorption
Degradation
Electrodes
Relaxation time
Gas absorption
Durability

Chemical Compounds

Hydrogen
Rubber
Gases
Polymers
O rings
Cracks
Anionic polymerization
Nuclear magnetic resonance
Acrylonitrile
Polymerization
Soot
Electrolytes
Composite materials
Monomers
Crack initiation
Ferroelectric materials
Conformations
Crack propagation
Ions
divinyl benzene
Phase transitions
Ionic conductivity
Temperature
Copolymerization
Tensile stress
Silicon Dioxide
Thermodynamic properties
Lithium
Addition reactions
Copolymers
Polyacetylenes
Styrene
Infrared absorption
Elastomers
1,3-butadiene
Molecules
Toluene
Fillers
Thermal expansion
Relaxation time
Electrodes
Gas absorption
Amino Acids
Plasticizers
Ultrasonic velocity
Chemical shift
Peptides
Swelling
Carbon Nanotubes
Acoustic emissions

Physics & Astronomy

Chemistry and Materials

butadiene
hydrogen
acrylonitriles
gases
composite materials
polymers
methylidyne
tensile properties
Nylon (trademark)
tetrahydrofuran

General

rubber
blisters
polymerization
damage
rings
fillers
penetration
polyacetylene
crack initiation
solid state
test equipment
durability
swelling

Engineering

sealing
pressure reduction
electrodes
electric batteries

Physics

nuclear magnetic resonance
ions