抄録
A new surface mount technology for over-40-Gb/s ICs has been developed. The technology features 8-mm-square leadless chip carrier packages and four-layer resin printed circuit boards. It was applied to build a prototype InP HFET multichip 1 : 4 DEMUX module, that operates at 45 Gb/s. This technology is promising for small, low-cost IC modules for over-40-Gb/s optical communication systems.
| 寄稿の翻訳タイトル | Surface Mount Technology for Over-40-Gb/s ICs |
|---|---|
| 本文言語 | 日本語 |
| ページ（範囲） | 43-47 |
| ページ数 | 5 |
| ジャーナル | IEICE technical report |
| 巻 | 101 |
| 号 | 555 |
| 出版ステータス | 出版済み - 1月 9 2002 |