3d Imaging for Thermal Cameras Using Structured Light

Jack Erdozain, Kazuto Ichimaru, Tomohiro Maeda, Hiroshi Kawasaki, Ramesh Raskar, Achuta Kadambi

研究成果: Chapter in Book/Report/Conference proceedingConference contribution

抄録

Optical 3D sensing technologies are exploited for many applications in autonomous vehicles, manufacturing, and consumer products. However, existing techniques may suffer in certain challenging conditions, where scattering may occur due to particles. While the light in the visible and near IR spectrum is affected by scattering, long-wave IR (LWIR) tends to experience less scattering, especially when the particles are much smaller than the incident radiation. We propose and demonstrate the expansion of structured light scanning approaches into the LWIR spectrum using a thermal camera and black body radiation source. We then validate the results produced against ground truth scans from traditional structured light scanners. Additional means for projecting these scanning patterns are also discussed alongside potential drawbacks and challenges of this technique associated with future adoption.

本文言語英語
ホスト出版物のタイトル2020 IEEE International Conference on Image Processing, ICIP 2020 - Proceedings
出版社IEEE Computer Society
ページ2795-2799
ページ数5
ISBN(電子版)9781728163956
DOI
出版ステータス出版済み - 10 2020
外部発表はい
イベント2020 IEEE International Conference on Image Processing, ICIP 2020 - Virtual, Abu Dhabi, アラブ首長国連邦
継続期間: 9 25 20209 28 2020

出版物シリーズ

名前Proceedings - International Conference on Image Processing, ICIP
2020-October
ISSN(印刷版)1522-4880

会議

会議2020 IEEE International Conference on Image Processing, ICIP 2020
Countryアラブ首長国連邦
CityVirtual, Abu Dhabi
Period9/25/209/28/20

All Science Journal Classification (ASJC) codes

  • Software
  • Computer Vision and Pattern Recognition
  • Signal Processing

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引用スタイル