A device for measuring thermal conductivity with a drop of liquid

T. Fukunaga, Y. Okuno, K. Kitamura, H. D. Wang, Kosaku Kurata, Hiroshi Takamatsu

研究成果: ジャーナルへの寄稿Conference article

抄録

Measurement of thermal conductivity of liquid was demonstrated with a sample considerably smaller than previously reported methods. The sensor that was named micro-beam sensor is a free-standing platinum strip suspended across a trench on a silicon substrate and heated in a sample liquid by DC. The temperature of the sensor is measured from the electrical resistance of the sensor. The measurement is based on the principle that the temperature rise of the sensor depends on the thermal conductivity of the liquid. The advantage of this method includes: 1) the system has a steady state because the substrate at both ends of the sensor remains at a constant temperature irrespective of heating, 2) the steady state is reached within several hundred microseconds because the sensor is only ~10 μm long, 3) the temperature of the sensor does not change after the initial rise due to heating because the effect of free convection is negligibly small, and 4) the sensor is useful for measuring small samples. Comparing the measured temperature rise with the result obtained by numerical analysis of steady-state heat conduction, we can determine the thermal conductivity of the sample liquid. To demonstrate the advantage of this method, we developed a device that consists of a micro-beam MEMS sensor placed in a micro chamber fabricated in a PDMS block. The fabricated platinum sensor was ~10 μm long, ~0.7 μm wide and 40 nm in thickness. The electrical and thermal properties were first determined as a function of temperature by a calibration experiment in a vacuum chamber together with two-dimensional electrical/thermal analyses. Then the thermal conductivities of four kinds of liquid, i.e. FC-72, toluene, ethanol and methanol, were measured at atmospheric pressure and temperature by injecting a sample of ~30 μL into the chamber with a micropipette. The measured thermal conductivity agreed with literature values within 4 % error.

元の言語英語
ページ(範囲)8955-8960
ページ数6
ジャーナルInternational Heat Transfer Conference
2018-August
出版物ステータス出版済み - 1 1 2018
イベント16th International Heat Transfer Conference, IHTC 2018 - Beijing, 中国
継続期間: 8 10 20188 15 2018

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Thermal conductivity
thermal conductivity
sensors
Sensors
Liquids
liquids
Platinum
Temperature
temperature
platinum
chambers
Thermal conductivity of liquids
Atmospheric temperature
Heating
atmospheric temperature
heating
Acoustic impedance
Toluene
Silicon
Substrates

All Science Journal Classification (ASJC) codes

  • Fluid Flow and Transfer Processes
  • Condensed Matter Physics
  • Mechanical Engineering

これを引用

A device for measuring thermal conductivity with a drop of liquid. / Fukunaga, T.; Okuno, Y.; Kitamura, K.; Wang, H. D.; Kurata, Kosaku; Takamatsu, Hiroshi.

:: International Heat Transfer Conference, 巻 2018-August, 01.01.2018, p. 8955-8960.

研究成果: ジャーナルへの寄稿Conference article

Fukunaga, T, Okuno, Y, Kitamura, K, Wang, HD, Kurata, K & Takamatsu, H 2018, 'A device for measuring thermal conductivity with a drop of liquid', International Heat Transfer Conference, 巻. 2018-August, pp. 8955-8960.
Fukunaga, T. ; Okuno, Y. ; Kitamura, K. ; Wang, H. D. ; Kurata, Kosaku ; Takamatsu, Hiroshi. / A device for measuring thermal conductivity with a drop of liquid. :: International Heat Transfer Conference. 2018 ; 巻 2018-August. pp. 8955-8960.
@article{8a86809bda904a618431755ad722b803,
title = "A device for measuring thermal conductivity with a drop of liquid",
abstract = "Measurement of thermal conductivity of liquid was demonstrated with a sample considerably smaller than previously reported methods. The sensor that was named micro-beam sensor is a free-standing platinum strip suspended across a trench on a silicon substrate and heated in a sample liquid by DC. The temperature of the sensor is measured from the electrical resistance of the sensor. The measurement is based on the principle that the temperature rise of the sensor depends on the thermal conductivity of the liquid. The advantage of this method includes: 1) the system has a steady state because the substrate at both ends of the sensor remains at a constant temperature irrespective of heating, 2) the steady state is reached within several hundred microseconds because the sensor is only ~10 μm long, 3) the temperature of the sensor does not change after the initial rise due to heating because the effect of free convection is negligibly small, and 4) the sensor is useful for measuring small samples. Comparing the measured temperature rise with the result obtained by numerical analysis of steady-state heat conduction, we can determine the thermal conductivity of the sample liquid. To demonstrate the advantage of this method, we developed a device that consists of a micro-beam MEMS sensor placed in a micro chamber fabricated in a PDMS block. The fabricated platinum sensor was ~10 μm long, ~0.7 μm wide and 40 nm in thickness. The electrical and thermal properties were first determined as a function of temperature by a calibration experiment in a vacuum chamber together with two-dimensional electrical/thermal analyses. Then the thermal conductivities of four kinds of liquid, i.e. FC-72, toluene, ethanol and methanol, were measured at atmospheric pressure and temperature by injecting a sample of ~30 μL into the chamber with a micropipette. The measured thermal conductivity agreed with literature values within 4 {\%} error.",
author = "T. Fukunaga and Y. Okuno and K. Kitamura and Wang, {H. D.} and Kosaku Kurata and Hiroshi Takamatsu",
year = "2018",
month = "1",
day = "1",
language = "English",
volume = "2018-August",
pages = "8955--8960",
journal = "International Heat Transfer Conference",
issn = "2377-424X",

}

TY - JOUR

T1 - A device for measuring thermal conductivity with a drop of liquid

AU - Fukunaga, T.

AU - Okuno, Y.

AU - Kitamura, K.

AU - Wang, H. D.

AU - Kurata, Kosaku

AU - Takamatsu, Hiroshi

PY - 2018/1/1

Y1 - 2018/1/1

N2 - Measurement of thermal conductivity of liquid was demonstrated with a sample considerably smaller than previously reported methods. The sensor that was named micro-beam sensor is a free-standing platinum strip suspended across a trench on a silicon substrate and heated in a sample liquid by DC. The temperature of the sensor is measured from the electrical resistance of the sensor. The measurement is based on the principle that the temperature rise of the sensor depends on the thermal conductivity of the liquid. The advantage of this method includes: 1) the system has a steady state because the substrate at both ends of the sensor remains at a constant temperature irrespective of heating, 2) the steady state is reached within several hundred microseconds because the sensor is only ~10 μm long, 3) the temperature of the sensor does not change after the initial rise due to heating because the effect of free convection is negligibly small, and 4) the sensor is useful for measuring small samples. Comparing the measured temperature rise with the result obtained by numerical analysis of steady-state heat conduction, we can determine the thermal conductivity of the sample liquid. To demonstrate the advantage of this method, we developed a device that consists of a micro-beam MEMS sensor placed in a micro chamber fabricated in a PDMS block. The fabricated platinum sensor was ~10 μm long, ~0.7 μm wide and 40 nm in thickness. The electrical and thermal properties were first determined as a function of temperature by a calibration experiment in a vacuum chamber together with two-dimensional electrical/thermal analyses. Then the thermal conductivities of four kinds of liquid, i.e. FC-72, toluene, ethanol and methanol, were measured at atmospheric pressure and temperature by injecting a sample of ~30 μL into the chamber with a micropipette. The measured thermal conductivity agreed with literature values within 4 % error.

AB - Measurement of thermal conductivity of liquid was demonstrated with a sample considerably smaller than previously reported methods. The sensor that was named micro-beam sensor is a free-standing platinum strip suspended across a trench on a silicon substrate and heated in a sample liquid by DC. The temperature of the sensor is measured from the electrical resistance of the sensor. The measurement is based on the principle that the temperature rise of the sensor depends on the thermal conductivity of the liquid. The advantage of this method includes: 1) the system has a steady state because the substrate at both ends of the sensor remains at a constant temperature irrespective of heating, 2) the steady state is reached within several hundred microseconds because the sensor is only ~10 μm long, 3) the temperature of the sensor does not change after the initial rise due to heating because the effect of free convection is negligibly small, and 4) the sensor is useful for measuring small samples. Comparing the measured temperature rise with the result obtained by numerical analysis of steady-state heat conduction, we can determine the thermal conductivity of the sample liquid. To demonstrate the advantage of this method, we developed a device that consists of a micro-beam MEMS sensor placed in a micro chamber fabricated in a PDMS block. The fabricated platinum sensor was ~10 μm long, ~0.7 μm wide and 40 nm in thickness. The electrical and thermal properties were first determined as a function of temperature by a calibration experiment in a vacuum chamber together with two-dimensional electrical/thermal analyses. Then the thermal conductivities of four kinds of liquid, i.e. FC-72, toluene, ethanol and methanol, were measured at atmospheric pressure and temperature by injecting a sample of ~30 μL into the chamber with a micropipette. The measured thermal conductivity agreed with literature values within 4 % error.

UR - http://www.scopus.com/inward/record.url?scp=85068339933&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85068339933&partnerID=8YFLogxK

M3 - Conference article

AN - SCOPUS:85068339933

VL - 2018-August

SP - 8955

EP - 8960

JO - International Heat Transfer Conference

JF - International Heat Transfer Conference

SN - 2377-424X

ER -