A multi-layer stacked all sol-gel fabrication technique for vertical coupled waveguide

Ahmad Syahrin Idris, Sampad Ghosh, Haisong Jiang, Kiichi Hamamoto

研究成果: ジャーナルへの寄稿記事

2 引用 (Scopus)

抄録

A multi-layer vertically stacked all sol-gel fabrication technique on bulk silicon is proposed to realize vertical coupling from planar waveguides to 3-dimensional structures. The all sol-gel fabrication technique realizes the capability to stack ZnO sol-gel core layer and SiO2 sol-gel cladding and core separation layers. A major issue with sol-gel based fabrication is the appearance of cracks on the sol-gel layer, and these were improved by a slow cooling process of 1°C/min after 500°C temperature annealing in addition to a SiO2 surface cleaning using photoresist remover. As a result, a multi-layer vertically stacked structure with a ZnO core layer thickness of 300 nm and SiO2 cladding/core separation layer thickness of 1.5 μm was successfully fabricated on bulk Si.

元の言語英語
ページ(範囲)12-17
ページ数6
ジャーナルEvergreen
4
発行部数2-3
DOI
出版物ステータス出版済み - 9 2017

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Sol-gels
Waveguides
gel
Fabrication
Surface cleaning
Planar waveguides
Silicon
Photoresists
annealing
silicon
Annealing
crack
Cooling
Cracks
cooling
temperature
Temperature

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Ceramics and Composites
  • Surfaces, Coatings and Films
  • Management, Monitoring, Policy and Law

これを引用

A multi-layer stacked all sol-gel fabrication technique for vertical coupled waveguide. / Idris, Ahmad Syahrin; Ghosh, Sampad; Jiang, Haisong; Hamamoto, Kiichi.

:: Evergreen, 巻 4, 番号 2-3, 09.2017, p. 12-17.

研究成果: ジャーナルへの寄稿記事

@article{395187e631af4fd5aaf9dfe249e3205e,
title = "A multi-layer stacked all sol-gel fabrication technique for vertical coupled waveguide",
abstract = "A multi-layer vertically stacked all sol-gel fabrication technique on bulk silicon is proposed to realize vertical coupling from planar waveguides to 3-dimensional structures. The all sol-gel fabrication technique realizes the capability to stack ZnO sol-gel core layer and SiO2 sol-gel cladding and core separation layers. A major issue with sol-gel based fabrication is the appearance of cracks on the sol-gel layer, and these were improved by a slow cooling process of 1°C/min after 500°C temperature annealing in addition to a SiO2 surface cleaning using photoresist remover. As a result, a multi-layer vertically stacked structure with a ZnO core layer thickness of 300 nm and SiO2 cladding/core separation layer thickness of 1.5 μm was successfully fabricated on bulk Si.",
author = "Idris, {Ahmad Syahrin} and Sampad Ghosh and Haisong Jiang and Kiichi Hamamoto",
year = "2017",
month = "9",
doi = "10.5109/1929657",
language = "English",
volume = "4",
pages = "12--17",
journal = "Evergreen",
issn = "2189-0420",
publisher = "Novel Carbon Resource Sciences",
number = "2-3",

}

TY - JOUR

T1 - A multi-layer stacked all sol-gel fabrication technique for vertical coupled waveguide

AU - Idris, Ahmad Syahrin

AU - Ghosh, Sampad

AU - Jiang, Haisong

AU - Hamamoto, Kiichi

PY - 2017/9

Y1 - 2017/9

N2 - A multi-layer vertically stacked all sol-gel fabrication technique on bulk silicon is proposed to realize vertical coupling from planar waveguides to 3-dimensional structures. The all sol-gel fabrication technique realizes the capability to stack ZnO sol-gel core layer and SiO2 sol-gel cladding and core separation layers. A major issue with sol-gel based fabrication is the appearance of cracks on the sol-gel layer, and these were improved by a slow cooling process of 1°C/min after 500°C temperature annealing in addition to a SiO2 surface cleaning using photoresist remover. As a result, a multi-layer vertically stacked structure with a ZnO core layer thickness of 300 nm and SiO2 cladding/core separation layer thickness of 1.5 μm was successfully fabricated on bulk Si.

AB - A multi-layer vertically stacked all sol-gel fabrication technique on bulk silicon is proposed to realize vertical coupling from planar waveguides to 3-dimensional structures. The all sol-gel fabrication technique realizes the capability to stack ZnO sol-gel core layer and SiO2 sol-gel cladding and core separation layers. A major issue with sol-gel based fabrication is the appearance of cracks on the sol-gel layer, and these were improved by a slow cooling process of 1°C/min after 500°C temperature annealing in addition to a SiO2 surface cleaning using photoresist remover. As a result, a multi-layer vertically stacked structure with a ZnO core layer thickness of 300 nm and SiO2 cladding/core separation layer thickness of 1.5 μm was successfully fabricated on bulk Si.

UR - http://www.scopus.com/inward/record.url?scp=85034623744&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85034623744&partnerID=8YFLogxK

U2 - 10.5109/1929657

DO - 10.5109/1929657

M3 - Article

AN - SCOPUS:85034623744

VL - 4

SP - 12

EP - 17

JO - Evergreen

JF - Evergreen

SN - 2189-0420

IS - 2-3

ER -