A novel CMP process using the size-controllable polyhydroxylated fullerene cluster

H. Tachika, Y. Takaya, T. Hayashi, K. Kokubo, K. Suzuki, K. Shirai

研究成果: 書籍/レポート タイプへの寄稿会議への寄与

抄録

We proposed a novel CMP process by using the poly-hydroxylated fullerene ( C60(OH)36 ). It is previously reported that the copper surface was improved from 16.5 nm RMS to 1 nm RMS using the C60(OH)36 molecule as an abrasive grain. However, the polishing rate is the drawback. Then, in this paper, the polishing rate was controlled using the size-controllable C60(OH)36 cluster from 1 to 200 nm by the UV laser irradiation. Consequently, the higher polishing rate (Max 300 nm/min) is achieved.

本文言語英語
ホスト出版物のタイトルProceedings of the 10th Anniversary International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2008
編集者Hendrik Van Brussel, E. Brinksmeier, H. Spaan, T. Burke
出版社euspen
ページ460-464
ページ数5
ISBN(電子版)9780955308253
出版ステータス出版済み - 2008
外部発表はい
イベント10th Anniversary International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2008 - Zurich, スイス
継続期間: 5月 18 20085月 22 2008

出版物シリーズ

名前Proceedings of the 10th Anniversary International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2008
2

その他

その他10th Anniversary International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2008
国/地域スイス
CityZurich
Period5/18/085/22/08

!!!All Science Journal Classification (ASJC) codes

  • 器械工学
  • 機械工学
  • 材料科学(全般)
  • 環境工学
  • 産業および生産工学

フィンガープリント

「A novel CMP process using the size-controllable polyhydroxylated fullerene cluster」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル