A rheological assessment of the effect of trace level Ni additions on the solidification of Sn-0.7Cu

C. M. Gourlay, K. Nogita, S. D. McDonald, T. Nishimura, K. Sweatman, A. K. Dahle

研究成果: Contribution to journalArticle査読

19 被引用数 (Scopus)

抄録

The influence of trace level Ni additions on the eutectic solidification mode of Sn-0.7Cu has been studied using continuous torque experiments during solidification. The solid fraction at which resistance to paddle rotation at the thermal centre of the sample occurs is related to the spatial distribution of solid during solidification. The results indicate that a transition in solidification mode occurs in the range 0-300 ppm Ni. Growth occurs antiparallel to heat flow from near the mould walls in the Ni-free alloy, while equiaxed growth from distributed centres dominates in alloys containing at least 300 ppm Ni.

本文言語英語
ページ(範囲)1557-1562
ページ数6
ジャーナルScripta Materialia
54
9
DOI
出版ステータス出版済み - 5 2006

All Science Journal Classification (ASJC) codes

  • 材料科学(全般)
  • 凝縮系物理学
  • 材料力学
  • 機械工学
  • 金属および合金

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