A software energy analysis method using ExecutableUML

Ryusuke Yoshimoto, Tomonori Kadono, Kenji Hisazumi, Akira Fukuda

研究成果: Chapter in Book/Report/Conference proceedingConference contribution

2 引用 (Scopus)

抜粋

The power consumption of an embedded system has been increased. It is important to analyze energy consumption while taking software behaviors into account to reduce energy consumption. Some studies propose model-based energy analysis. Although these method can estimate energy usage within a short time as compared with code-based analysis, the problem is that these technique cannot detect the bottleneck of energy consumption in software behavior in the design stage. This paper proposes an energy consumption analysis method for multi-granularity of ExecutableUML models. The method is useful for detecting the bottleneck of energy consumption in software behavior in the design stage. We also demonstrate that the error of our energy analysis method is, on average, 9.0%.

元の言語英語
ホスト出版物のタイトルProceedings of the 2016 IEEE Region 10 Conference, TENCON 2016
出版者Institute of Electrical and Electronics Engineers Inc.
ページ218-221
ページ数4
ISBN(電子版)9781509025961
DOI
出版物ステータス出版済み - 2 8 2017
イベント2016 IEEE Region 10 Conference, TENCON 2016 - Singapore, シンガポール
継続期間: 11 22 201611 25 2016

出版物シリーズ

名前IEEE Region 10 Annual International Conference, Proceedings/TENCON
ISSN(印刷物)2159-3442
ISSN(電子版)2159-3450

その他

その他2016 IEEE Region 10 Conference, TENCON 2016
シンガポール
Singapore
期間11/22/1611/25/16

All Science Journal Classification (ASJC) codes

  • Computer Science Applications
  • Electrical and Electronic Engineering

フィンガープリント A software energy analysis method using ExecutableUML' の研究トピックを掘り下げます。これらはともに一意のフィンガープリントを構成します。

  • これを引用

    Yoshimoto, R., Kadono, T., Hisazumi, K., & Fukuda, A. (2017). A software energy analysis method using ExecutableUML. : Proceedings of the 2016 IEEE Region 10 Conference, TENCON 2016 (pp. 218-221). [7847993] (IEEE Region 10 Annual International Conference, Proceedings/TENCON). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/TENCON.2016.7847993