A study of adhesion interface about die bonding structure with conductive silver paste

Naoaki Tsurumi, Noriyuki Masago, Taiki Baba, Hiroyuki Murata, Yuta Tsuji, Kazunari Yoshizawa

研究成果: 著書/レポートタイプへの貢献会議での発言

抄録

In the electronic packages, gold surfaces are useful for stable connections. In this paper, adhesion interface for die bonding structure with conductive silver paste is investigated. The adhesive interface between gold surface and epoxy resin is investigated in two approaches. The first-principles calculations are employed to optimize the structure and calculate the theoretical bonding strength. The fragment model is constructed for bisphenol-A type epoxy resin and a curing agent which includes dicyandiamide. The results show that a cyano group included in the hardener greatly interacts with ideal gold surface, whereas a hydroxyl group seems not to interact with them regardless of high polarity. This interaction is likely to come from the π-back donation. The predicted bonding strength is as high as 1.15GPa. Next, the actual die pad surfaces prepared with plating gold are characterized to presume the substantial bonding structure by analytical method. Besides, measurements of adhesive strength have been performed by using small size lap shear tests under various temperatures. These results show that there are altered layers at the top of plating gold, which seems to affect the interaction mechanisms to hydrogen bond and make the adhesive strength lower.

元の言語英語
ホスト出版物のタイトル2018 IEEE CPMT Symposium Japan, ICSJ 2018
出版者Institute of Electrical and Electronics Engineers Inc.
ページ45-48
ページ数4
ISBN(電子版)9781538654422
DOI
出版物ステータス出版済み - 1 4 2019
イベント2018 IEEE CPMT Symposium Japan, ICSJ 2018 - Kyoto, 日本
継続期間: 11 19 201811 21 2018

出版物シリーズ

名前2018 IEEE CPMT Symposium Japan, ICSJ 2018

会議

会議2018 IEEE CPMT Symposium Japan, ICSJ 2018
日本
Kyoto
期間11/19/1811/21/18

Fingerprint

Adhesive pastes
Ointments
Silver
adhesion
Adhesion
silver
Gold plating
Gold
gold
Epoxy Resins
Adhesives
adhesives
Epoxy resins
epoxy resins
plating
hardeners
bisphenols
Hydroxyl Radical
Curing
Hydrogen bonds

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality
  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Atomic and Molecular Physics, and Optics

これを引用

Tsurumi, N., Masago, N., Baba, T., Murata, H., Tsuji, Y., & Yoshizawa, K. (2019). A study of adhesion interface about die bonding structure with conductive silver paste. : 2018 IEEE CPMT Symposium Japan, ICSJ 2018 (pp. 45-48). [8602784] (2018 IEEE CPMT Symposium Japan, ICSJ 2018). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICSJ.2018.8602784

A study of adhesion interface about die bonding structure with conductive silver paste. / Tsurumi, Naoaki; Masago, Noriyuki; Baba, Taiki; Murata, Hiroyuki; Tsuji, Yuta; Yoshizawa, Kazunari.

2018 IEEE CPMT Symposium Japan, ICSJ 2018. Institute of Electrical and Electronics Engineers Inc., 2019. p. 45-48 8602784 (2018 IEEE CPMT Symposium Japan, ICSJ 2018).

研究成果: 著書/レポートタイプへの貢献会議での発言

Tsurumi, N, Masago, N, Baba, T, Murata, H, Tsuji, Y & Yoshizawa, K 2019, A study of adhesion interface about die bonding structure with conductive silver paste. : 2018 IEEE CPMT Symposium Japan, ICSJ 2018., 8602784, 2018 IEEE CPMT Symposium Japan, ICSJ 2018, Institute of Electrical and Electronics Engineers Inc., pp. 45-48, 2018 IEEE CPMT Symposium Japan, ICSJ 2018, Kyoto, 日本, 11/19/18. https://doi.org/10.1109/ICSJ.2018.8602784
Tsurumi N, Masago N, Baba T, Murata H, Tsuji Y, Yoshizawa K. A study of adhesion interface about die bonding structure with conductive silver paste. : 2018 IEEE CPMT Symposium Japan, ICSJ 2018. Institute of Electrical and Electronics Engineers Inc. 2019. p. 45-48. 8602784. (2018 IEEE CPMT Symposium Japan, ICSJ 2018). https://doi.org/10.1109/ICSJ.2018.8602784
Tsurumi, Naoaki ; Masago, Noriyuki ; Baba, Taiki ; Murata, Hiroyuki ; Tsuji, Yuta ; Yoshizawa, Kazunari. / A study of adhesion interface about die bonding structure with conductive silver paste. 2018 IEEE CPMT Symposium Japan, ICSJ 2018. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 45-48 (2018 IEEE CPMT Symposium Japan, ICSJ 2018).
@inproceedings{996edee67e32454ea06633d02bef37d5,
title = "A study of adhesion interface about die bonding structure with conductive silver paste",
abstract = "In the electronic packages, gold surfaces are useful for stable connections. In this paper, adhesion interface for die bonding structure with conductive silver paste is investigated. The adhesive interface between gold surface and epoxy resin is investigated in two approaches. The first-principles calculations are employed to optimize the structure and calculate the theoretical bonding strength. The fragment model is constructed for bisphenol-A type epoxy resin and a curing agent which includes dicyandiamide. The results show that a cyano group included in the hardener greatly interacts with ideal gold surface, whereas a hydroxyl group seems not to interact with them regardless of high polarity. This interaction is likely to come from the π-back donation. The predicted bonding strength is as high as 1.15GPa. Next, the actual die pad surfaces prepared with plating gold are characterized to presume the substantial bonding structure by analytical method. Besides, measurements of adhesive strength have been performed by using small size lap shear tests under various temperatures. These results show that there are altered layers at the top of plating gold, which seems to affect the interaction mechanisms to hydrogen bond and make the adhesive strength lower.",
author = "Naoaki Tsurumi and Noriyuki Masago and Taiki Baba and Hiroyuki Murata and Yuta Tsuji and Kazunari Yoshizawa",
year = "2019",
month = "1",
day = "4",
doi = "10.1109/ICSJ.2018.8602784",
language = "English",
series = "2018 IEEE CPMT Symposium Japan, ICSJ 2018",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "45--48",
booktitle = "2018 IEEE CPMT Symposium Japan, ICSJ 2018",
address = "United States",

}

TY - GEN

T1 - A study of adhesion interface about die bonding structure with conductive silver paste

AU - Tsurumi, Naoaki

AU - Masago, Noriyuki

AU - Baba, Taiki

AU - Murata, Hiroyuki

AU - Tsuji, Yuta

AU - Yoshizawa, Kazunari

PY - 2019/1/4

Y1 - 2019/1/4

N2 - In the electronic packages, gold surfaces are useful for stable connections. In this paper, adhesion interface for die bonding structure with conductive silver paste is investigated. The adhesive interface between gold surface and epoxy resin is investigated in two approaches. The first-principles calculations are employed to optimize the structure and calculate the theoretical bonding strength. The fragment model is constructed for bisphenol-A type epoxy resin and a curing agent which includes dicyandiamide. The results show that a cyano group included in the hardener greatly interacts with ideal gold surface, whereas a hydroxyl group seems not to interact with them regardless of high polarity. This interaction is likely to come from the π-back donation. The predicted bonding strength is as high as 1.15GPa. Next, the actual die pad surfaces prepared with plating gold are characterized to presume the substantial bonding structure by analytical method. Besides, measurements of adhesive strength have been performed by using small size lap shear tests under various temperatures. These results show that there are altered layers at the top of plating gold, which seems to affect the interaction mechanisms to hydrogen bond and make the adhesive strength lower.

AB - In the electronic packages, gold surfaces are useful for stable connections. In this paper, adhesion interface for die bonding structure with conductive silver paste is investigated. The adhesive interface between gold surface and epoxy resin is investigated in two approaches. The first-principles calculations are employed to optimize the structure and calculate the theoretical bonding strength. The fragment model is constructed for bisphenol-A type epoxy resin and a curing agent which includes dicyandiamide. The results show that a cyano group included in the hardener greatly interacts with ideal gold surface, whereas a hydroxyl group seems not to interact with them regardless of high polarity. This interaction is likely to come from the π-back donation. The predicted bonding strength is as high as 1.15GPa. Next, the actual die pad surfaces prepared with plating gold are characterized to presume the substantial bonding structure by analytical method. Besides, measurements of adhesive strength have been performed by using small size lap shear tests under various temperatures. These results show that there are altered layers at the top of plating gold, which seems to affect the interaction mechanisms to hydrogen bond and make the adhesive strength lower.

UR - http://www.scopus.com/inward/record.url?scp=85061698000&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85061698000&partnerID=8YFLogxK

U2 - 10.1109/ICSJ.2018.8602784

DO - 10.1109/ICSJ.2018.8602784

M3 - Conference contribution

T3 - 2018 IEEE CPMT Symposium Japan, ICSJ 2018

SP - 45

EP - 48

BT - 2018 IEEE CPMT Symposium Japan, ICSJ 2018

PB - Institute of Electrical and Electronics Engineers Inc.

ER -