Adsorption characteristics of parent and copper-sputtered RD silica gels

B. B. Saha, A. Chakraborty, S. Koyama, J. B. Lee, J. He, K. C. Ng

研究成果: ジャーナルへの寄稿学術誌査読

8 被引用数 (Scopus)

抄録

Surface modification of type RD silica gel was achieved by depositing layers of thin-film copper on the parent silica gel surfaces so as to improve their performances, circumventing the poor thermal conductivity of the adsorbent. Porous properties (surface area, pore size and volume) were determined using nitrogen adsorption/desorption isotherm measurements, which were performed on adsorbents for both parent and Cu-sputtered silica gels in liquid nitrogen at a temperature of 77.4K. The copper sputtering experiments were conducted in a chamber of inert argon gas where the chamber was bombarded with a radio frequency (RF) of 13.56MHz. The comparative performance of the parent and Cu-sputtered silica gels was determined via various key measurements such the Brunauer-Emmett-Teller (BET), the Horvath and Kawazoe (HK) and the hot-disc sensor methods.

本文言語英語
ページ(範囲)1113-1121
ページ数9
ジャーナルPhilosophical Magazine
87
7
DOI
出版ステータス出版済み - 3月 2007

!!!All Science Journal Classification (ASJC) codes

  • 凝縮系物理学

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