Advanced transmission electron microscopy on silver-based conductive adhesive

Naoyuki Kawamoto, Yasukazu Murakami, Daisuke Shindo, Keunsoo Kim, Katsuaki Suganuma

研究成果: ジャーナルへの寄稿記事

6 引用 (Scopus)

抜粋

Microstructure of a recently developed silver-based conductive adhesive, which is expected as a substitute for conventional soldering, has been studied by advanced transmission electron microscopy (TEM). Energy-filtered TEM has revealed the feature of dispersion of silver particles. Conductivity between neighbored particles is evaluated inside the electron microscope by using two microprobes that can be operated independently. The results shed light on the development of the silver-based conductive adhesive.

元の言語英語
ページ(範囲)384-388
ページ数5
ジャーナルNippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
70
発行部数4
DOI
出版物ステータス出版済み - 4 1 2006
外部発表Yes

    フィンガープリント

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Mechanics of Materials
  • Metals and Alloys
  • Materials Chemistry

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