抄録
Advances in CMP Polishing Technologies demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering.
| 元の言語 | 英語 |
|---|---|
| 出版者 | Elsevier Inc. |
| ISBN（印刷物） | 9781437778595 |
| DOI | |
| 出版物ステータス | 出版済み - 1 1 2012 |
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All Science Journal Classification (ASJC) codes
- Engineering(all)
これを引用
Advances in CMP Polishing Technologies. / Doi, Toshiro; Marinescu, Ioan D.; Kurokawa, Syuhei.
Elsevier Inc., 2012.研究成果: 著書/レポートタイプ › 著書
}
TY - BOOK
T1 - Advances in CMP Polishing Technologies
AU - Doi, Toshiro
AU - Marinescu, Ioan D.
AU - Kurokawa, Syuhei
PY - 2012/1/1
Y1 - 2012/1/1
N2 - Advances in CMP Polishing Technologies demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering.
AB - Advances in CMP Polishing Technologies demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering.
UR - http://www.scopus.com/inward/record.url?scp=85013732055&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85013732055&partnerID=8YFLogxK
U2 - 10.1016/C2009-0-20355-2
DO - 10.1016/C2009-0-20355-2
M3 - Book
SN - 9781437778595
BT - Advances in CMP Polishing Technologies
PB - Elsevier Inc.
ER -