Aging behavior of Cu-Ni-Si alloy processed by high-pressure torsion

Hirotaka Matsunaga, Zenji Horita, Kazutaka Imamura, Takanobu Kiss, Xavier Sauvage

研究成果: Chapter in Book/Report/Conference proceedingConference contribution

6 被引用数 (Scopus)

抄録

An age-hardenable Cu-2.9%Ni-0.6%Si alloy was subjected to high-pressure torsion. Aging behavior was investigated in terms of hardness, electrical conductivity and microstructural features. Transmission electron microscopy showed that the grain size is refined to ∼150 nm and the Vickers microhardness was significantly increased through the HPT process. Aging treatment of the HPT-processed alloy led to a further increase in the hardness. Electrical conductivity is also improved with the aging treatment. It was confirmed that the simultaneous strengthening by grain refinement and fine precipitation is achieved while maintaining high electrical conductivity. Three dimensional atom probe analysis revealed that fine precipitates with sizes of ∼20 nm or smaller were formed in the Cu matrix and some particles consist of Ni and Si with no appreciable amount of Cu.

本文言語英語
ホスト出版物のタイトルNanomaterials by Severe Plastic Deformation, NanoSPD5
ページ307-312
ページ数6
DOI
出版ステータス出版済み - 2 25 2011
イベント5th International Conference on Nanomaterials by Severe Plastic Deformation, NanoSPD5 - Nanjing, 中国
継続期間: 3 21 20113 25 2011

出版物シリーズ

名前Materials Science Forum
667-669
ISSN(印刷版)0255-5476

その他

その他5th International Conference on Nanomaterials by Severe Plastic Deformation, NanoSPD5
国/地域中国
CityNanjing
Period3/21/113/25/11

All Science Journal Classification (ASJC) codes

  • 材料科学(全般)
  • 凝縮系物理学
  • 材料力学
  • 機械工学

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