An experimental investigation of flow boiling characteristics in a single transparent heated microtube

Osamu Kawanami, Shih Che Huang, Kazunari Kawakami, Itsuro Honda, Yousuke Kawashima, Haruhiko Ohta

研究成果: Chapter in Book/Report/Conference proceedingConference contribution

抄録

In the present study, flow boiling in a transparent heated microtube having a diameter of 1 mm was investigated in detail. The transparent heated tube was manufactured by the electroless gold plating method. The enclosed gas-liquid interface could be clearly recognized through the tube wall, and the inner wall temperature measurement and direct heating of the film were simultaneously conducted by using the tube. Deaerated and deionized water that was subcooled temperature of 15 K was used as a test fluid, and constant and stable mass velocities of 50, 100, and 200 kg/m2s were provided by using a twin plunger pump. Among our experimental results, a vapor bubble grew up in a direction opposite the flow at a low heat flux and low mass velocities; however, this flow pattern was not observed at a high mass velocity of 200 kg/m 2s. Under the conditions of G = 50 kg/m2s and high heat flux, the liquid film surrounding an elongated bubble near the heated tube wall occasionally thickened partially. The inner wall temperature exhibited large random oscillations in this regime; however, the visual observation revealed that dry-patches did not occur. The mass velocity had a negligible effect on the boiling heat transfer except in the counter-growth bubble flow regime.

本文言語英語
ホスト出版物のタイトルProceedings of the ASME InterPack Conference 2009, IPACK2009
ページ379-387
ページ数9
DOI
出版ステータス出版済み - 6 30 2010
イベント2009 ASME InterPack Conference, IPACK2009 - San Francisco, CA, 米国
継続期間: 7 19 20097 23 2009

出版物シリーズ

名前Proceedings of the ASME InterPack Conference 2009, IPACK2009
2

その他

その他2009 ASME InterPack Conference, IPACK2009
国/地域米国
CitySan Francisco, CA
Period7/19/097/23/09

All Science Journal Classification (ASJC) codes

  • ハードウェアとアーキテクチャ
  • 電子工学および電気工学

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