@article{3d8eba91ff194855afb016a0237a47de,
title = "Anisotropic mechanical properties of Cu 6Sn 5 and (Cu,Ni) 6Sn 5 ",
abstract = "The mechanical reliability of solder joints is influenced by a layer of Cu 6Sn 5 intermetallics (IMC) present at the interface of tin-based solders/Cu substrates. We have discovered that the mechanical properties of hexagonal Cu 6Sn 5 are strongly related to the crystal orientation, using Electron Back Scattered Diffraction (EBSD) and nanoindentation on unidirectionally solidified Sn4 wt% Cu with/without 0.05 wt% Ni. This fundamental discovery on the anisotropic mechanical properties of Cu 6Sn 5 may find practical applications in designing soldering processes to obtain preferred IMC orientations.",
author = "D. Mu and H. Huang and K. Nogita",
note = "Funding Information: The authors would like to thank Mr J. Read, Dr. S. McDonald and Dr Y-Q Wu (UQ) for sample preparation and stimulating discussion. The authors are also grateful to the financial supports under an International Cooperative Research Program between the University of Queensland (UQ), Australia and Nihon Superior Company, Japan and the ARC Linkage Project program (no. LP100200250 ). D. Mu is financially supported by an Australian Postgraduate Award . The authors acknowledge the facilities, and the scientific and technical assistance, of the Australian Microscopy & Microanalysis Research Facility at the Centre for Microscopy and Microanalysis, The University of Queensland. ",
year = "2012",
month = nov,
day = "1",
doi = "10.1016/j.matlet.2012.07.018",
language = "English",
volume = "86",
pages = "46--49",
journal = "Materials Letters",
issn = "0167-577X",
publisher = "Elsevier",
}